Method for forming compact LCD packages and devices formed in which first bonding PCB to LCD panel and second bonding driver chip to PCB

A method for forming a compact LCD package comprising the steps of:

• providing an LCD display panel by bonding an upper glass panel and a lower glass panel together with a liquid crystal material sandwiched thereinbetween, said lower glass panel being larger in area than said upper glass panel producing an exposed edge portion equipped with a first multiplicity of conductive elements thereon,
• providing at least one driver chip equipped with solder bumps on an active surface for electrically connecting to said first multiplicity of conductive elements on said lower glass,
• providing a printed circuit board (PCB) having a second multiplicity of conductive leads on a top surface in electrical communication with a third multiplicity of conductive leads on a bottom surface,
• providing an insulating film of thermally fusible material loaded with electrically conductive particles therein,
• positioning sequentially said insulating film of thermally fusible material on top of said exposed portion of said lower glass over said first multiplicity of conductive elements and said PCB on top of said insulating film with said third multiplicity of conductive leads contacting said film forming a first stack,
• compressing said first stack under a pressure and temperature sufficient to establish electrical communication between said third multiplicity of conductive leads on said PCB and said first multiplicity of conductive elements on said exposed edge portion of said LCD display panel through said electrically conductive particles in said insulating film,
• positioning said at least one driver chip on top of said PCB, said at least one driver chip overlapping said exposed portion of said lower glass with said solder bumps contacting said second multiplicity of conductive leads forming a second stack, and
• compressing said second stack under a pressure and temperature sufficient to establish electrical communication between said solder bumps on said at least one driver chip and said second multiplicity of conductive leads on said PCB.