Back to results
US 6,556,105 B1Granted
Surface wave device connected to a base with a conductive adhesive
AssigneeThomson-CSF
InventorsNgoc-Tuan Nguyen, Jean-Marc Bureau, Christian LeLong
Life of this patent
Estimating the term…
Abstract
The invention relates to a surface wave device linked to a base by a conductive material which is anisotropic in a direction perpendicular to the plane of the surface wave device and of the base. This anisotropic conductive material provides for the mechanical efficacy and the encapsulation of the surface wave device. It is deposited locally in the plane of the base, in such a way as to provide for the presence of a cavity in which the surface acoustic waves can propagate.
Claims11
Encapsulated surface wave component comprising:
- a surface wave device on an active surface of a piezoelectric substrate, said surface wave device comprising interdigital electrodes linked to conducting buses;
- a base comprising electrodes linked to external conducting pads;
- wherein the active surface of the surface wave device is assembled to the base by a conductive adhesive which is anisotropic along an axis Z, perpendicular to a plane of the surface wave device, at a level of the conducting buses opposite the electrodes of the base in such a way as to provide for electrical connections, the electrodes of the base having structures in relief constituting barriers against creeping of the anisotropic conductive adhesive towards active zones of the surface wave device, with local thickenings configured to compress the anisotropic conductive adhesive locally.
Dependencies are inferred from the claim text.