Semiconductor chip having pads with plural junctions for different assembly methods

A semiconductor chip comprising:

• a substrate on which an integrated circuit and a plurality of pads are formed;
• a film covering a surface of the substrate, said film having a plurality of groups of at least two apertures, each of said groups formed at a position corresponding to each of the pads;
• a plurality of first junctions, each of said first junctions being structured to be exposed through first apertures for permanently receiving a wire bond electrically connected with a wire, each of said first junctions being arranged near an outer circumference of a surface of the substrate;
• and
• a plurality of second junctions being structured by adding conductive material so as to project through second apertures, and each of said second junctions being arranged near a center of the surface of the substrate.

A semiconductor device comprising:

• a substrate;
• at least one pad formed on the substrate;
• a protective film covering the substrate and the at least one pad, the protective film having at least first and second apertures formed therein exposing the at least one pad to form respective pad junctions, wherein the first aperture is disposed near a central portion of the substrate, and the second aperture is disposed along a peripheral edge of the substrate for permanently receiving a wire bond electrically connected with a wire;
• and
• a conductive material disposed in the first aperture on the exposed pad.

A semiconductor device comprising:

• a semiconductor chip;
• at least one conductive pattern on the semiconductor chip;
• and
• a protective film which covers the semiconductor chip and the at least one conductive pattern, wherein the protective film includes a first opening exposing a first portion of the at least one conductive pattern and a second opening exposing a second portion of the at least one conductive pattern,
• wherein the at least one conductive pattern is electrically connected to a conductive element by a bump through the first opening, or by a wire through the second opening.

A semiconductor device comprising:

• a semiconductor chip on which an integrated circuit is formed;
• and
• a protective film covering the integrated circuit, said protective film having a plurality of opening groups,
• each of the plurality of opening groups respectively including a first opening exposing a first pad and a second opening exposing a second pad, wherein the first pad of a respective opening group of the plurality of opening groups is electrically connected to the second pad of the respective opening group,
• wherein a conductive element is electrically connected to the first pad of the respective opening group by a bump through the first opening of the respective opening group, or to the second pad of the respective opening group by a wire through the second opening of the respective opening group.