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US 6,555,922 B1Granted
IC bonding pad combined with mark or monitor
AssigneeFujitsu Limited
InventorKenji Nakagawa
Life of this patent
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Abstract
A semiconductor device includes a bonding pad formed on a substrate and a mark region formed on the substrate right underneath the bonding pad, such that the mark region is covered by the bonding pad.
Claims13
A semiconductor device, comprising:
- a substrate;
- an active device formed on said substrate, said active device forming a circuit;
- a bonding pad formed on said substrate;
- and
- a mark pattern formed between said substrate and said bonding pad in the form of a pattern isolated from the circuit, such that said mark pattern is covered by said bonding pad,
- said mark pattern being functional for measurement of positional alignment.
3 more elements
A semiconductor device, comprising:
- a substrate;
- an active device formed on said substrate, said active device forming a circuit;
- a bonding pad formed on said substrate;
- and
- a monitoring pattern formed on said substrate under said bonding pad in the form of a pattern isolated from the circuit, such that said monitoring pattern is covered by said bonding pad,
- said monitoring pattern being functional for monitoring of a semiconductor fabrication process.
3 more elements
A semiconductor device, comprising:
- a substrate;
- an active device formed on said substrate;
- a bonding pad formed on said substrate;
- a monitoring pattern formed on said substrate under said bonding pad, such that said monitoring pattern is covered by said bonding pad;
- another bonding pad adjacent to said bonding pad in electrical connection with said monitoring pattern;
- and
- another monitoring pattern formed right underneath said another bonding pad.
4 more elements
Dependencies are inferred from the claim text.