High-frequency integrated circuit and high-frequency circuit device using the same
AssigneeMitsubishi Denki Kabushiki Kaisha
InventorTakayuki Katoh
Life of this patent
Estimating the term…
Abstract
An RF signal input terminal having an RF signal input pad connected to a switching element and grounding pads adjacent to the RF signal input pad, and RF signal output terminals, so that the directions of arrangements of signal pads and grounding pads adjacent thereto extend parallel to the direction of an arrangement of the RF signal input pad and grounding pads of the RF signal input terminal. The signal pads are connected to the switching element, and are disposed on a semiconductor substrate provided with the switching element.
Claims14
A high-frequency integrated circuit comprising:
- a semiconductor substrate;
- a first circuit element disposed on said semiconductor substrate and having a plurality of signal terminals;
- a first connecting port disposed on said semiconductor substrate and having a first signal pad connected to said first circuit element and grounding pads adjacent to said first signal pad, said first signal pad and grounding pads being arranged along a straight line;
- a second connecting port disposed on said semiconductor substrate and having a second signal pad connected to said first circuit element and grounding pads adjacent to said second signal pad, parallel to the straight line of said first signal pad and said grounding pads of said first connecting port;
- and
- a third connecting port disposed on said semiconductor substrate and having a third signal pad connected to said first circuit element and grounding pads adjacent to said third signal pad, parallel to the straight line of said first signal pad and said grounding pads of said first connecting port.
A high-frequency circuit device comprising:
- a conductive mounting substrate;
- dielectric substrates disposed on said conductive mounting substrate and having surfaces on which signal lines are disposed;
- a high-frequency integrated circuit disposed on said conductive mounting substrate and comprising a semiconductor substrate, a first circuit element disposed on said semiconductor substrate and having a plurality of signal terminals, a first connecting port disposed on said semiconductor substrate and having a first signal pad connected to said first circuit element and grounding pads adjacent to said first signal pad, said first signal pad and said ground pads being arranged along a straight line, a second connecting port disposed on said semiconductor substrate and having a second signal pad connected to said first circuit element and grounding pads adjacent to said second signal pad, parallel to the straight line of said first signal pad and said grounding pads of said first connecting port, and a third connecting port disposed on said semiconductor substrate and having a third signal pad connected to said first circuit element and grounding pads adjacent to said third signal pad, parallel to the straight line of said first signal pad and said grounding pads of said first connecting port;
- and
- connecting conductors respectively connecting the respective signal pads of said connecting ports of said high-frequency integrated circuit and said signal lines of said dielectric substrates.
Dependencies are inferred from the claim text.