Heat conductive silicone composition and semiconductor device

A heat conductive silicone composition comprising

• (A) 100 parts by weight of one or more organopolysiloxanes having at least two alkenyl groups in a molecule,
• (B) an organohydrogenpolysiloxane having at least two silicon atom-bonded hydrogen atoms in a molecule, represented by the following general formula (1):
• wherein R1 is an alkyl group of 1 to 6 carbon atoms, and n and m are integers satisfying 0.01≦n/(n+m)≦0.3, in an amount that the ratio of the number of Si-H groups in component (B) to the number of alkenyl groups in component (A) range from 0.8/1 to 1.5/1,
• (C) 800 to 1,200 parts by weight of a filler consisting of aluminum powder and zinc oxide powder in a weight ratio of from 1/1 to 10/1,
• (D) 0.01 to 10 parts by weight of an organosilane of the following general formula (2):
• R2aR3bSi(OR4)4−a−b (2)
• wherein R is an alkyl group of 9 to 15 carbon atoms, R is a monovalent hydrocarbon group of 1 to 8 carbon atoms, R is an alkyl group of 1 to 6 carbon atoms, “a” is an integer of 1 to 3, “b” is an integer of 0 to 2, and a+b is an integer of 1 to 3,
• (E) a catalyst selected from the group consisting of platinum and platinum compounds in such an amount as to give 0.1 to 500 parts by weight of platinum atoms per million parts by weight of component (A), and
• (F) 0.01 to 1 part by weight of a regulator.