Package, semiconductor device and method for fabricating the semiconductor device
AssigneeMatsushita Electric Industrial Co., Ltd.
InventorsShigeru Morimoto, Yorito Ota, Masahiro Maeda
Life of this patent
Estimating the term…
Abstract
A package according to the present invention includes: a support for mounting a semiconductor component on the upper surface thereof; a positioning control plate, which is secured to the support and includes an opening or a notch; and a lead provided on the support for establishing electrical continuity between the semiconductor component mounted on the support and an external component. The positioning control plate houses at least a lower part of the semiconductor component inside the opening or the notch, thereby controlling a position of the semiconductor component on the support.
Claims3
A package comprising:
- a support for mounting a semiconductor component on the upper surface thereof;
- a positioning control plate, which is provided on the support and includes an opening or a notch that passes through the top to the bottom surfaces of the positioning control plate;
- a lead provided on the support for establishing electrical continuity between the semiconductor component mounted on the support and an external component, and
- a platelike control plate bond member provided between the support and the positioning control plate including an opening or a notch in substantially the same shape as that of the positioning control plate;
- wherein the positioning control plate houses at least a lower part of the semiconductor component inside the opening or the notch, thereby controlling a position of the semiconductor component on the support.
A semiconductor device comprising:
- a support;
- a positioning control plate, which is provided on the support and includes an opening or a notch that passes through the top to the bottom surfaces of the positioning control plate;
- a semiconductor component bonded to the support in such a manner that at least a lower part of the semiconductor component is housed inside the opening or the notch of the positioning control plate;
- a lead provided on the support for establishing electrical continuity between the semiconductor component and an external component;
- and
- a platelike control plate bond member provided between the support and the positioning control plate including an opening or a notch in substantially the same shape as that of the positioning control plate.
Dependencies are inferred from the claim text.