Dam structure for center-bonded chip package
AssigneeMicron Technology, Inc.
InventorRichard W. Wensel
Life of this patent
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Abstract
The present invention provides a packaged chip that includes at least one dam disposed between the chip and interposer, blocking an encapsulant flow path in the package formed by the assembly of the interposer and chip. In one preferred embodiment, the dam comprises a lead-like structure formed on the interposer that closes an encapsulant flow path in the package. The invention further provides a novel interposer that may be assembled with a chip into the novel packaged chip. Methods are also provided for making the packaged chip and the interposer.
Claims29
A packaged chip comprising:
- a chip having one or more bonding pads disposed off the edges of the chip;
- an interposer attached to the chip, the interposer having one or more leads interconnected to the one or more bonding pads, at least a portion of the interconnections between leads and bonding pads being covered by an encapsulant;
- at least one encapsulant flow path located between the interposer and the chip;
- and
- at least one dam disposed between the chip and interposer and blocking the flow path.
A packaged chip comprising:
- a chip having a plurality of bonding pads disposed substantially along a central axis on a surface of the chip;
- an interposer attached to the chip forming a flow path therebetween, the interposer having leads interconnected to the bonding pads, the leads being interconnected along a conductive pathway to connectors on the interposer, the interconnections formed by the bonding pads and leads being substantially covered by an encapsulant to form an interconnection region, the interposer having at least one dam located between the interposer and the chip for blocking the flow path.
An interposer for attachment to a chip, comprising:
- a substrate having one or more conductive traces for making electrical connections with bonding pads on a chip;
- and
- a dam disposed on the interposer to extend between the interposer and the chip for blocking an encapsulant flow path formed between the interposer and the chip.
An interposer for attachment to a chip, comprising:
- a flexible substrate having one or more conductive traces electrically connected to one or more leads for interconnecting with bonding pads on a chip, one or more of the leads being off the edge of the interposer for interconnecting with bonding pads off an edge of the chip;
- and
- a dam disposed on the interposer to extend between the interposer and the chip for blocking an encapsulant flow path formed between the interposer and the chip.
Dependencies are inferred from the claim text.