Assembly for attaching die to leads
AssigneeMicron Technology, Inc.
InventorHugh E. Stroupe
Life of this patent
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Abstract
A semiconductor die assembly comprising a semiconductor die with bond pads, a plurality of leads which extend across the semiconductor die and terminate over their respective bond pads, and an alpha barrier preferably positioned between the leads and the semiconductor die. Electrical connection is made between the leads and their respective bond pads by a strip of anisotropically conductive elastomeric material, preferably a multi-layer laminate consisting of alternating parallel sheets of a conductive foil and an insulating elastomer wherein the laminate layers are oriented perpendicular to both the bond pad and the lead, positioned between the leads and the bond pads. A burn-in die according to the present invention is also disclosed.
Claims14
A burn-in die test assembly for testing of a semiconductor die comprising:
- a plurality of circuit traces mounted to a substrate, each end of the plurality of circuit traces forming a pattern on a surface of said substrate, said pattern corresponding to a pattern of bond pads of a semiconductor die;
- and
- at least a portion of an elongated strip of anisotropically conductive elastomeric material comprising a laminate of alternating, substantially parallel sheets of a conductive foil and segments of an insulating elastomer, said elongated strip disposed over said pattern between the ends of said plurality of circuit traces on said substrate surface, said plurality of circuit traces for connecting to corresponding bond pads by conductive paths formed by said sheets of said conductive foil.
A test assembly for testing of a semiconductor die comprising:
- a plurality of circuit traces on a substrate, at least a portion of the plurality of circuit traces forming a pattern on a surface of said substrate, said pattern corresponding to a pattern of bond pads of a semiconductor die;
- and
- at least a portion of an elongated strip of anisotropically conductive elastomeric material comprising a laminate of alternating, substantially parallel sheets of a conductive foil and segments of an insulating elastomer, said elongated strip disposed over said pattern between each end of said plurality of circuit traces on said substrate surface, said plurality of circuit traces for connecting to corresponding bond pads by conductive paths formed by said sheets of said conductive foil.
Dependencies are inferred from the claim text.