Heating apparatus of hot-heat treatment device using semiconductor device
AssigneeMigun Medical Instrument Co., Ltd.
InventorSang-bok Lee
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Abstract
A heating apparatus of a hot-heat treatment device using a semiconductor device includes a heating element positioned in a heating cap for heating a transmission cover after being conducted when electric power is supplied thereto; a circuit board electrically connected with the heating element, for controlling a voltage and a temperature; and a fixing unit for integrally fixing the heating element within the heating cap. Since the light bulb in the heating structure of the heating cap for pressurizing and fomenting the diseased part of the body of the user as in the conventional art is replaced with a semiconductor device. Accordingly, its case is prevented from deforming and the lead wire is prevented from breaking due to heat, so that a high-quality product can be provided.
Claims4
A heating apparatus of a hot-heat treatment device using a semiconductor device comprising:
- a heating element positioned in a heating cap for heating the heating cap after being conducted when electric power is supplied thereto;
- a circuit board electrically connected with the heating element, for controlling a voltage and a temperature;
- and
- a fixing unit for integrally fixing the heating element with the heating cap;
- wherein the fixing unit is formed by coating silicon grease or heat-resistant epoxy.
Dependencies are inferred from the claim text.