Electronic package having substrate with electrically conductive through holes filled with polymer and conductive composition
AssigneeInternational Business Machines Corporation
InventorsBernd K. Appelt, Jeffrey D. Gelorme, Sung Kwon Kang, Voya R. Markovich, Kostas Papathomas, Sampath Purushothaman
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Abstract
The present invention provides a unique, high density, electronic package having a conductive composition for filling vias or through holes to make reliable vertical or Z-connects from a dielectric layer to adjacent electrical circuits. The through holes may be plated or non-plated prior to filling. A description for making high density electronic packaging using this feature is also disclosed.
Claims3
A microelectronic package, whose circuitry has a cross-section width of between 0.7 mil and 2.0 mil, said microelectronic package comprising:
- a) a dielectric substrate having upper and lower lateral faces and at least one via being defined by a wall;
- b) electronic circuitry and features affixed to at least one of said lateral surfaces, said circuitry having a cross-sectional width of between 0.7 mil and 2.0 mil;
- and
- c) a composition comprising an interpenetrating network substantially filling said via, said network comprising a first matrix of cured thermosetting or thermoplastic material and a second matrix comprising an electrically conductive composition electrically connecting said via to said electronic circuitry.
Dependencies are inferred from the claim text.