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US 6,555,761 B2Granted
Printed circuit board with solder-filled via
AssigneeIntel Corporation
InventorDudi Amir
Life of this patent
Estimating the term…
Abstract
A plated-through hole via is substantially filled with solder rather than with traditional polymer to reduce printed circuit board failure due to outgassing from improperly cured polymer via fill. The solder via fill is in some embodiments eutectic or high-temperature solder, and in some further embodiments is capped at least one end with a barrier.
Claims17
A printed circuit board via, comprising:
- a plated-through hole;
- solder, substantially filling the plated-through hole;
- and
- a cap covering the solder-filled plated-through hole via, the cap comprising a material other than solder.
1 more element
A method of making a printed circuit board via, comprising:
- forming a plated-through hole;
- substantially filling the plated-through hole via with solder;
- and
- sealing the solder-filled plated-through hole via with a cap comprising a material other than solder.
1 more element
A printed circuit board, comprising:
- at least one plated-through hole via that is substantially filled with solder and that is capped with a material other than solder.
Dependencies are inferred from the claim text.