Multiple blank for electronic components such as SAW components, and method of building up bumps, solder frames, spacers and the like
AssigneeEpcos AG
InventorsAlois Stelzl, Hans Krüger, Karl Weidner, Manfred Wossler
Life of this patent
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Abstract
The multiple blank can be diced into individual blanks for electronic components, in particular surface acoustic wave components. Each of the individual blanks is suitable for contact to be made with chips in the flip-chip technique and for contact to be made with the individual blanks in the SMD technique, using external connections. The multiple blank has, for each individual blank, metalized areas which are located on a network which is integrated between layers of the multiple blank and leads to a connecting terminal. Bumps are built up by depositing metal by electroplating on the metalized areas.
Claims6
A multiple blank assembly, comprising:
- a plurality of layers defining a multiple blank separable into individual blanks for electronic components, the individual blanks being configured to be mounted in SMD technique using external connections and to have mounted thereon chips in flip-chip mounting technique;
- first and second networks integrated between said layers of said multiple blank and respectively connected to a first connecting terminal and a second connecting terminal;
- said multiple blank being formed with first metalized areas for each individual blank for making contact with bumps between said first metalized areas and the chips, said first metalized areas of said multiple blank being interconnected via said first network and to said first connecting terminal;
- a plurality of SMD contact elements connected to said first contact areas via plated-through holes formed in said multiple blank;
- and
- said multiple blank being formed with second metalized areas connected via said second network to said second connecting terminal.
Dependencies are inferred from the claim text.