Printed wiring board having cavity for mounting electronic parts therein and method for manufacturing thereof

A printed wiring board comprising:

• an upper plate-like wiring substrate formed of a non-conductive material having a first through-hole extending between a top surface and a bottom surface thereof, wherein said first through-hole includes a conductive, side wall layer on a side wall of the first through-hole, said conductive side wall layer extending completely through said first through-hole from the top surface to the bottom surface of the upper wiring substrate, wherein said first through-hole is filled with a non-conductive material extending completely through said first through-hole from said top surface to said bottom surface of said upper wiring substrate, and wherein said upper wiring substrate further includes a first conductive layer formed over a top surface of the first through-hole in the top surface of the upper wiring substrate to cover said non-conductive material which fills said first through-hole and to contact said conductive side wall layer of said first through-hole, said first conductive layer being provided to mount a first electronic part on the top surface of the upper wiring substrate, and
• wherein said upper wiring substrate further comprises a second conductive layer formed over a bottom surface of the first through-hole in the bottom surface of the upper wiring substrate, to cover the non-conductive material of the through-hole and to electrically contact the conductive side wall layer of the first through-hole, said conductive layer being provided to mount a second electronic part on the bottom surface of the upper wiring substrate;
• and
• a lower wiring substrate formed of non-conductive material, said lower wiring substrate being attached to the bottom surface of the upper wiring substrate, wherein the upper and lower wiring substrates combine to form a body having a cavity formed by the upper and lower wiring substrates to receive the second electronic part to be mounted on the bottom surface of the upper wiring substrate,
• further comprising a first external electrode formed on a second plated through-hole, to electrically conduct between a conductive layer on on the top surface of the upper wiring substrate and a conductive layer formed on a bottom surface of the lower wiring substrate, and
• wherein said first external electrode is formed on a side-end surface of the body of said printed wiring board formed by combining said upper wiring substrate and said lower wiring substrate.