Flexible interconnecting substrate and method of manufacturing the same, film carrier, tape-shaped semiconductor device, semiconductor device, circuit board, and electronic equipment
AssigneeSeiko Epson Corporation
InventorMasahiko Yanagisawa
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Abstract
A flexible interconnecting substrate comprises a base substrate of an elongate form and interconnecting patterns formed on the base substrate, where each of the interconnecting patterns has a plurality of interconnects and each of the interconnects has a portion that extends to the right and a portion that extends to the left, with respect to the longitudinal axis of the base substrate. Each interconnecting pattern has narrow portions and that narrow in the widthwise direction of the base substrate and wide portions and that broaden in the widthwise direction of the base substrate.
Claims28
A flexible interconnecting substrate comprising a tape-shaped base substrate and a plurality of interconnecting patterns formed on said base substrate, wherein:
- each of said interconnecting patterns has a plurality of interconnects, at least one of the interconnects includes ends that are separated along a longitudinal direction of the base substrate, and
- each of the interconnects has a first portion that progresses along the longitudinal direction and shifts obliquely with respect to a longitudinal axis of said base substrate and toward the longitudinal axis, and a second portion that progresses along the longitudinal direction and shifts obliquely with respect to the longitudinal axis and away from the longitudinal axis.
A method of manufacturing a flexible interconnecting substrate comprising a step of forming a plurality of interconnecting patterns on a base substrate of an elongate form, wherein:
- each of said interconnecting patterns has a plurality of interconnects, at least one of the interconnects includes ends that are separated along a longitudinal direction of the base substrate, and
- a first portion of each of the interconnects is formed to progress along the longitudinal direction and shift obliquely with respect to a longitudinal axis of said base substrate and toward the longitudinal axis and a second portion of each of the interconnects is formed to progress along the longitudinal direction and shift obliquely with respect to the longitudinal axis and away from the longitudinal axis.
Dependencies are inferred from the claim text.