Composition of epoxy resin, anhydride and microcapsule accelerator
AssigneeNitto Denko Corporation
InventorsTadaaki Harada, Toshitsugu Hosokawa
Life of this patent
Estimating the term…
Abstract
The present invention provides a resin composition for semiconductor encapsulation excellent in reliability in humidity resistance and storage stability as well as in dischargeability and coatability, a semiconductor device encapsulated with the resin composition for semiconductor encapsulation and a process for the production of the semiconductor device. The resin composition for semiconductor encapsulation comprises the following components (A) to (D) and has a viscosity of 700 Pa•s or higher at 25° C. and 500 Pa•s or lower at 80° C.: (A) an epoxy resin; (B) an acid anhydride-based curing agent; (C) a latent curing accelerator; and (D) an inorganic filler.
Claims5
A resin composition for semiconductor encapsulation which comprises the following components (A) to (D) and which has a viscosity as measured at 25° C. of 700 Pa•s or higher or is solid at 25° C. and has a viscosity as measured at 80° C. of 500 Pa•s or lower:
- (A) an epoxy resin;
- (B) an acid anhydride-based curing agent;
- (C) a latent curing accelerator;
- and
- (D) an inorganic filler;
- wherein said latent curing accelerator is a microcapsule curing accelerator having a core-shell structure comprising a core portion comprising a curing accelerator encapsulated with a shell portion mainly composed of a polymer having a structural unit represented by the following general formula (1):
- wherein R1 and R2, which may be the same or different, each represents a hydrogen atom or a monovalent organic group.
Dependencies are inferred from the claim text.