US 6,555,592 B2 · Photothermosetting composition comprising acrylated epoxy resin

Abstract

A photothermosetting composition is described which contains a base resin (A), a photopolymerizable photomonomer or photooligomer (B), a photoinitiator (C), an epoxide compound containing at least two epoxy groups (D), and an organic solvent. The base resin (A) an epoxide compound (a) containing at least two epoxy groups, an unsaturated monobasic acid (b), a saturated or unsaturated dibasic acid (c), and a saturated or unsaturated acid anhydride (d) according to the ratio of (a)/(b)/(c) of 1:0.90˜0.95:0.025˜0.050 and the acid value of the base resin is in the range of 40˜49 mg KOH/g. This photothermosetting component was coating on the substrate, and then dried by baking, exposed by light, developed, irradiated by ultraviolet light or heated, and cured to form a solder mask.

Claims12

Dependent claims

A photothermosetting composition comprising:

(A) a base resin obtained from the reaction of the following components:
(a) an epoxy resin composition containing at least two epoxy groups;
(b) an unsaturated monobasic acid;
(c) a saturated or unsaturated dibasic acid having the following structure:
HOOC—R—COOH
R:
C1˜C12, aliphatic or aromatic
(d) saturated or unsaturated acid anhydride;
in which, the molar ratio of (a) (b),and (c), is 1:0.90˜0.95:0.025˜0.050, the acid value of the obtained base resin is in the range of 40˜49 mg KOH/g;
(B) a photopolymerizable photomonomer or photooligomer;
(C) a photoinitiator;
(D) an epoxide compound containing at least two epoxy groups which is a solid, semi-solid or liquid at an ambient temperature, or is solid/semi-solid/liquid mixed for use at an ambient temperature and is able to soluble in organic solvent;
(E) an organic solvent.

10 more elements

Dependencies are inferred from the claim text.

Photothermosetting composition comprising acrylated epoxy resin

Life of this patent

Photothermosetting composition comprising acrylated epoxy resin

Life of this patent

Abstract

Claims12