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US 6,555,444 B1Granted
Device and method for core buildup using a separator
AssigneeIntel Corporation
InventorJuan Landeros
Life of this patent
Estimating the term…
Abstract
A device and method to manufacture two substrates simultaneously using a separator. The separator is sandwiched between two cores and adhesive is used to affix to the first core to the second core. Layers are affixed to the first core and the second core simultaneously. The cores are then separated and the separator removed to form two substrates.
Claims12
A method of manufacturing substrates, comprising:
- creating a first and second core;
- placing adhesive at the outer edges of the first core;
- placing a separator between the first and second core;
- affixing the first core to the second core with the separator sandwiched between the first and second core;
- placing layers simultaneously on the first core and the second core;
- and
- separating the first core from the second core.
4 more elements
A method of manufacturing substrates, comprising:
- placing adhesive at the outer edges of a first core;
- placing a separator between the first core and a second core;
- affixing the first core to the second core with the separator sandwiched between the first and second core;
- placing layers simultaneously on the first core and the second core;
- and
- separating the first core from the second core, wherein the layers placed on the first core and second core have traces and through holes embedded in each layer.
3 more elements
Dependencies are inferred from the claim text.