Electronic configuration with flexible bonding pads

A method for producing an electronic configuration having a first surface with at least one electrical contact for bonding, which comprises:

• providing an electronic configuration having a first surface;
• configuring at least one flexible elevation made of an insulating material on the first surface;
• providing the flexible elevation with at least one recess;
• at least partially covering a surface of the flexible elevation with an electrically conductive material to form an electrical contact;
• applying an insulating layer at least partially to the first surface;
• forming a structural feature in a region of the insulating layer;
• forming the structural feature as a feature selected from the group consisting of a depression formed in the region of the insulating layer and a roughened surface formed in the region of the insulating layer;
• providing the insulating layer with a metallization at least in the region of the structural feature;
• forming a recess selected from the group consisting of a first recess running perpendicularly in relation to the first surface and a second recess running parallel in relation to the first surface;
• when selecting the first recess as the recess, configuring the flexible elevation over the structural feature;
• when selecting the second recess as the recess, configuring the flexible elevation directly alongside the structural feature;
• performing the step of forming the recess by directing laser light towards the structural feature such that the structural feature performs an operation selected from the group consisting of focusing the laser light and scattering the laser light;
• and
• applying an electrically conductive material at least partially to the surface of the flexible elevation.