Method for interconnecting semiconductor elements to form a thermoelectric cooler and a thermoelectric cooler formed therefrom
AssigneesTriQuint Technology Holding Co., Agere Systems Inc.
InventorsJoseph M. Freund, George J. Przybylek, Mindaugas F. Dautartas
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Abstract
A method for electrically coupling thermoelectric cooling (TEC) elements together is described. The TEC elements are encased within an encapsulating material, such as epoxy, and a resist layer is laid on either end of the encapsulating material, covering the ends of the TEC elements. The resist layers are selectively developed to open locations in the resist layers in between adjacent elements. Conductive material, such as gold, is sputter deposited into the locations to provide electrical coupling of the elements.
Claims20
An apparatus, comprising:
- a heat transfer structure including:
- a plurality of heat transfer elements each having a positively-doped region and a negatively-doped region;
- an encapsulating material encapsulating each said heat transfer element in a block;
- and
- conductive connectors formed on said encapsulating material and electrically connecting said heat transfer elements together;
- and
- an optoelectronic device electrically connected to said heat transfer structure.
A thermoelectric cooling device, comprising:
- a plurality of heat transfer elements each having a positively-doped region and a negatively-doped region;
- an encapsulating material interspersed among and encapsulating said heat transfer elements in a block;
- and
- conductive connectors electrically connecting said heat transfer elements together, said conductive connectors being formed on said encapsulating material.
A method for fabricating a semiconductor device, comprising:
- encapsulating each of a plurality of heat transfer elements within an encapsulating material to form a block of encapsulated heat transfer elements, each said element having a positively-doped and a negatively-doped region;
- providing at least one resist layer, said layer covering an end of the heat transfer elements;
- selectively preparing locations in the resist layer, each of the locations extending to the encapsulating material and between one said heat transfer element and an adjacent said heat transfer element;
- and
- forming conductive material in the locations, wherein the conductive material electrically connects the heat transfer elements together.
Dependencies are inferred from the claim text.