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US 6,555,412 B1Granted
Packaged semiconductor chip and method of making same
AssigneeMicron Technology, Inc.
InventorRichard W. Wensel
Life of this patent
Estimating the term…
Abstract
The present invention provides a packaged chip that includes at least one dam disposed between the chip and interposer, blocking an encapsulant flow path in the package formed by the assembly of the interposer and chip. In one preferred embodiment, the dam comprises a lead-like structure formed on the interposer that closes an encapsulant flow path in the package. The invention further provides a novel interposer that may be assembled with a chip into the novel packaged chip. Methods are also provided for making the packaged chip and the interposer.
Claims45
A method of forming a packaged chip comprising:
- providing a chip having one or more bonding pads located substantially centrally of the chip;
- attaching the chip to an interposer forming an encapsulant flow path therebetween, the interposer having one or more leads for bonding to the bonding pads;
- interconnecting the leads to the bonding pads to form an interconnection region;
- placing a dam between the interposer and the chip to extend across the encapsulant flow path in the package;
- and
- introducing an encapsulant to at least a portion of the interconnection region.
3 more elements
A method of forming a packaged chip comprising:
- providing a chip having one or more bonding pads located substantially centrally of the chip;
- attaching the chip to an interposer comprising a flexible substrate forming an encapulant flow path therebetween, the interposer having one or more leads for bonding to the bonding pads;
- interconnecting the leads to the bonding pads to form an interconnection region;
- placing a dam disposed on the interposer between the interposer and the chip to extend across the encapsulant flow path in the package;
- and
- introducing an encapsulant to at least a portion of the interconnection region.
3 more elements
A method of forming an interposer for attachment to a chip, comprising:
- providing a flexible substrate having a chip-attach area for attachment to a chip;
- forming on the substrate conductive traces terminating in a plurality of leads for making electrical connections with bonding pads on a chip;
- and
- forming a dam on the interposer within the chip-attach area to extend between the interposer and the chip for blocking an encapsulant flow path formed from an assembly of the interposer with the chip.
1 more element
A method of forming an interposer for attachment to a chip, comprising:
- providing a flexible substrate having a chip-attach area for attachment to a chip;
- forming one or more conductive traces on the substrate;
- forming one or more leads electrically connected to traces for interconnecting with bonding pads on a chip, one or more of the leads being located substantially centrally of the interposer for interconnection with bonding pads located substantially centrally of the chip;
- and
- forming a dam disposed on the interposer to extend between the interposer and the chip for blocking an encapsulant flow path in a structure resulting from a combination of the interposer with the chip, the dam comprising a deflectable structure on the interposer positioned within the chip attach area of the substrate.
2 more elements
A method of forming a packaged chip comprising:
- providing a chip having one or more bonding pads thereon spaced away from outer edges of the chip substantially along a central axis;
- attaching the chip to an interposer comprising a flexible substrate and having at least one dam disposed thereupon, the interposer having one or more leads for bonding to the bonding pads;
- interconnecting the leads to the bonding pads to form an interconnection region;
- wherein the dam is constructed and arranged to extend between the interposer and the chip to block flow of encapsulant along a flow path, the flow path being formed between the chip and the interposer at one or both ends of the centrally disposed interconnections;
- and
- introducing an encapsulant to at least a portion of the interconnection region to cover interconnections.
3 more elements
A method of forming a packaged chip comprising:
- providing a chip having one or more bonding pads located substantially centrally of the chip;
- attaching the chip to an interposer comprising a flexible substrate having a chip-attach area within which the chip is attached, the interposer having one or more leads for bonding to the bonding pads;
- interconnecting the leads to the bonding pads to form an interconnection region;
- placing a dam disposed on the interposer within the chip-attach area between the interposer and the chip to extend across an encapsulant flow path in the package, wherein the dam comprises a lead dam on the interposer;
- and
- introducing an encapsulant to at least a portion of the interconnection region.
3 more elements
A method of forming an interposer for attachment to a chip, comprising:
- providing a flexible substrate having a first surface and a second surface opposing the first surface;
- forming on the first surface of the substrate conductive traces terminating in a plurality of leads for making electrical connections with bonding pads on a chip forming a chip-interposer assembly;
- and
- forming a dam on the interposer to extend between the interposer and the chip for blocking an encapsulant flow path formed between the interposer and the chip, wherein the dam is disposed on the interposer so as to reside inside the perimeter of the chip-interposer assembly, and wherein the dam comprises a structure formed on the first surface of the substrate, the structure being deflectable from the first surface toward the second surface so as to be positionable across the flow path.
1 more element
A method of forming an interposer for attachment to a chip, comprising:
- providing a flexible substrate having a fist surface and a second surface through which the substrate is attached to a chip;
- forming one or more conductive traces on the first surface of the substrate;
- forming one or more leads electrically connected to traces for interconnecting with bonding pads on the chip, one or more of the leads being located substantially centrally of the substrate for interconnection with bonding pads located substantially centrally of the chip, wherein an elastomer is attached on the second surface for stress decoupling in interconnections made between the one or more leads and the bonding pads;
- and
- forming a dam disposed on the interposer to extend between the interposer and the chip for blocking an encapsulant flow path in a structure resulting from a combination of the interposer with the chip, the dam comprising a deflectable structure on the interposer, wherein the dam comprises a real or dummy lead formed on the first surface of the substrate and extend towards the second surface of the substrate.
2 more elements
A method of forming an interposer for attachment to a chip, comprising:
- providing a flexible substrate;
- forming one or more conductive traces on the substrate;
- forming one or more leads electrically connected to traces for interconnecting with a central array of bonding pads on a chip, one or more of the leads being located substantially centrally of the interposer for interconnection with bonding pads located substantially centrally of the chip, the leads being disposed on a first surface of the substrate in a centrally disposed array forming a center-bonded package with the chip;
- wherein an elastomer is attached to a second surface of the substrate for stress decoupling in interconnections made between leads and the bonding pads;
- and
- forming a dam disposed on the interposer to extend between the interposer and the chip for blocking an encapsulant flow path in a structure resulting from a combination of the interposer with the chip, the dam comprising a deflectable structure on the interposer provided at one or both ends of the centrally disposed leads for blocking the flow path formed at the ends of the array when the interposer is attached to the chip.
3 more elements
A method of forming a packaged chip comprising:
- providing a chip having one or more bonding pads disposed substantially along a central axis of the chip;
- attaching the chip to an interposer, the interposer having one or more leads for bonding to the bonding pads;
- interconnecting the leads to the bonding pads to form an interconnection region;
- placing a dam between the interposer and the chip to extend across an encapsulant flow path formed between the interposer and the chip;
- and
- introducing an encapsulant to at least a portion of the interconnection region;
- the dam preventing the encapsulant from flowing out of the interconnection region.
4 more elements
A method of forming a packaged chip comprising:
- providing a chip having one or more bonding pads disposed substantially along a central axis of the chip;
- attaching the chip to an interposer comprising a flexible substrate, the interposer having one or more leads for bonding to the bonding pads;
- interconnecting the leads to the bonding pads to form an interconnection region;
- placing a dam disposed on the interposer between the interposer and the chip to extend across an encapsulant flow path formed between the interposer and the chip;
- and
- introducing an encapsulant to at least a portion of the interconnection region;
- the dam preventing the encapsulant from flowing out of the interconnection region.
4 more elements
A method of forming a packaged chip comprising:
- providing a chip having one or more bonding pads thereon;
- attaching the chip to an interposer forming an encapsulant flow path therebetween, the interposer having one or more leads for bonding to the bonding pads;
- interconnecting the leads to the bonding pads to form an interconnection region;
- placing a dam between the interposer and the chip to extend across the encapsulant flow path;
- and
- introducing an encapsulant to at least a portion of the interconnection region.
3 more elements
A method of forming a packaged chip comprising:
- providing a chip having one or more bonding pads thereon;
- attaching the chip to an interposer comprising a flexible substrate having at least one dam disposed thereon;
- the interposer having one or more leads for bonding to the bonding pads;
- interconnecting the leads to the bonding pads to form an interconnection region having opposed ends, an encapsulant flow path formed between the chip and the interposer at the opposed ends of the interconnection region;
- and
- introducing an encapsulant to at least a portion of the interconnection region to cover the interconnections between the leads and bonding pads, the dam being constructed and arranged to extend between the interposer and the chip to block the flow of encapsulant from the interconnection region.
3 more elements
A method of forming a packaged chip comprising:
- providing a chip having one or more bonding pads thereon;
- attaching the chip to an interposer comprising a flexible substrate having at least one dam disposed thereon, the interposer having one or more leads for bonding to the bonding pads;
- interconnecting the leads to the bonding pads to form an interconnection region located within a cavity formed between the chip and the interposer;
- and
- introducing an encapsulant to at least a portion of the interconnection region, the dam being positioned between the interposer and the chip to prevent encapsulant from flowing out of the cavity.
2 more elements
Dependencies are inferred from the claim text.