US 6,555,209 B1Granted

Method of manufacturing multilayer wiring board

AssigneeDaiwa Co., Ltd.

InventorsEiji Yoshimura, Toshiro Higuchi

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Abstract

A method of manufacturing a multilayer wiring board comprising a step of forming an upper wiring layer (27), a part thereof being electrically connected to a pillar-shaped metallic body (24a), after he pillar-shaped metal body (24a) is formed on a lower wiring layer (22) is characterized in that the step of forming the metallic body includes a sub-step of forming a plating layer (24) constituting the metallic body, a sub-step of forming a mask layer (25) on the surface where the metal body is formed, of the plating layer, and a sub-step of etching the plating layer. The manufacture can be carried out with simple equipment combination of conventional steps and the wiring layer can be made fine. Moreover, a multilayer wiring board having a high reliability can be manufactured,

Claims16

Dependent claims

A multilayer wiring board manufacturing method comprising the steps of forming a pillar-like metallic body on a lower wiring layer, and then forming an upper wiring layer, a part thereof being electrically connected with said pillar-like metallic body, wherein the pillar-like metallic body forming step comprises the steps of:

(1a) coating an approximately whole surface of said lower wiring layer previously patterned and a non-patterned portion, with another metal showing resistance at the time of etching the metal constituting said pillar-like metallic body to form a protective metallic layer;
(1b) forming a plating layer of the metal which is to constitute said pillar-like metallic body, on an approximately whole surface of said protective metallic layer by means of electrolytic plating;
(1c) forming a mask layer on a surface portion of said plating layer where said pillar-like metallic body is to be formed;
(1d) etching said plating layer;
and
(1e) etching under conditions wherein at least said protective metallic layer can be corroded to remove a portion of said protective metallic layer covering the non-patterned portion.

3 more elements

(2a) forming a conductive layer in a pattern for a lower wiring layer-to-be-formed on a surface of a metallic panel layer provided on an approximately whole surface of an insulating layer, the conductive layer having resistance at the time of etching the metallic panel layer;
(2b) forming a plating layer of metal which can be etched simultaneously as said metallic panel layer on an approximately whole surface of said metallic panel layer with said conductive layer;
(2c) forming a mask layer in a pattern for a pillar-like metallic body-to-be-formed on a surface portion of said plating layer where said pillar-like metallic body is formed;
and
(2d) etching, as a single etching process, (i) said metallic panel layer to remain in the pattern of the conductive layer and (ii) said plating layer to remain in the pattern of the mask so as to form said lower wiring layer and said pillar-like metallic body.

2 more elements

Dependencies are inferred from the claim text.

Facts

Application: 09/914,819Filed 31 Aug 2001
Priority: JP 11-0557313 Mar 1999
Granted: 29 Apr 2003
Term ends: Not estimatedThe source records don’t support an estimate.

Classification9 codes

B32B 3/00
Layered products comprising a layer with external or internal discontinuities or unevennesses
H05K 3/4647
By building the multilayer layer by layer, i.e. build-up multilayer circuits: by applying an insulating layer around previously made via studs
H05K 2203/0384
Metal processing: etch stop layer, i.e. a buried barrier layer for preventing etching of layers under the etch stop layer
H05K 2203/0542
Patterning and lithography: continuous temporary metal layer over metal pattern