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US 6,555,200 B2Granted
Method of making semiconductor devices, semiconductor device, circuit board, and electronic apparatus
AssigneeSeiko Epson Corporation
InventorNobuaki Hashimoto
Life of this patent
Estimating the term…
Abstract
A method of making semiconductor devices comprising the steps of: preparing non-defective individual film packages having good quality, wherein leads are formed and a semiconductor chip is mounted on each of the film packages; attaching each of the non-defective individual packages to each of mounting portions of a plate; and cutting the plate into separate pieces, each of the separated pieces corresponding to each of the mounting portions on which each of the non-defective individual film packages is mounted.
Claims44
A method of making semiconductor devices, comprising the steps of:
- preparing film packages, wherein each of said film packages has a substrate having a front surface on which a semiconductor chip is mounted and a back surface opposite thereof;
- attaching each of said film packages to each of mounting regions of a reinforcing member, said reinforcing member maintaining a planar configuration for said substrate;
- and
- cutting said reinforcing member into separate pieces, each of said separated pieces corresponding to each of said mounting regions.
1 more element
Dependencies are inferred from the claim text.