Sealing material composition for liquid crystal
AssigneeMitsui Chemicals, Inc.
InventorTadashi Kitamura
Life of this patent
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Abstract
Provided is a liquid crystal sealant composition in which an aqueous solution obtained by admixing the epoxy resin composition with purified water has an ionic conductivity of 1 mS/m or less; the B stage-reduced product has a viscosity of 50 to 10000 Pa·s at 80 to 100° C.; the cured matter of the above composition has a linear expansion coefficient of 10×10−5 mm/mm/° C. or less and a glass transition temperature Tg of 100° C. or higher; and the above cured matter has a moisture permeability of 200 g/m2·24 hours or less at 80° C. and which can meet a liquid crystal display element (cell) produced by a single layer press hot bonding system and exhibits high adhesion reliability and makes it possible to produce a homogeneous liquid crystal display element having a high quality.
Claims42
A liquid crystal sealant composition comprising an epoxy resin composition, wherein
- (a) an aqueous solution obtained by admixing said composition with the same mass of purified water has an ionic conductivity of 1 mS/m or less and
- (b) a coated material obtained by coating said epoxy resin composition in a thickness of 50 μm and subjecting it to heat treatment at 80 to 100° C. for 20 minutes is in B-stage and has a viscosity of 50 to 10000 Pa·s at 80 to 100° C. by an E type viscometer;
- and in a cured matter of the epoxy resin composition,
- (c) the cured matter of the composition has a linear expansion coefficient of 10×10−5 mm/mm/° C. or less at 0° C. to 100° C., which is determined by means of a thermomechanical analyzer (TMA),
- (d) the cured matter of the composition has a glass transition temperature Tg of 100° C. or higher, which is determined by means of a thermomechanical analyzer (TMA), and
- (e) a cured matter having a thickness of 100 μm which is formed from said composition has a moisture permeability of 200 g/m2·24 hours or less at 80° C. at which moisture passes through said cured matter.
A liquid crystal sealant composition comprising:
- (1) 20 to 88.9 mass % of an epoxy resin having 1.2 or more epoxy groups on an average in a molecule,
- (2) 1 to 15 mass % of a rubber-like polymer fine particle having a softening point of 0° C. or lower and a primary particle diameter of 5 μm or less,
- (3) 5 to 50 mass % of an inorganic filler,
- (4) 5 to 30 mass % of a thermally active potential curing agent for epoxy resin, and
- (5) 0.1 to 9.5 mass % of a high softening point-polymer fine particle having a softening point of 50° C. or higher and a primary particle diameter of 2 μm or less.
Dependencies are inferred from the claim text.