Process and apparatus for nickel plating and nickel-plated product
AssigneeToshiba Tec Kabushiki Kaisha
InventorsTakashi Harakawa, Hideaki Nonaka
Life of this patent
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Abstract
According to the present invention, Ni—B is electrolessly deposited on an object and then Ni—P is electrolessly deposited on the surface of the Ni—B layer formed on the object. In this process, if any dry area is present on the Ni—B layer where moisture has been evaporated after the Ni—B depositing step and before the Ni—P depositing step, it is difficult to form a uniform Ni—P layer on the Ni—B layer in such area. Accordingly, an additional step is provided for preventing the Ni—B layer formed on the object from drying after the Ni—B plating step and before the Ni—P plating step. In this way, a uniform Ni—P layer can be electrolessly deposited on the electrolessly deposited Ni—B layer.
Claims19
An apparatus for nickel plating, comprising:
- a Ni—B plating bath containing a Ni—B plating solution in which a substrate is immersed for electroless Ni—B deposition;
- a Ni—P plating bath containing a Ni—P plating solution in which the substrate having the Ni—B layer formed thereon is immersed for electroless Ni—P deposition;
- a transporting member for transporting the substrate from the Ni—B plating bath to the Ni—P plating bath;
- and
- a drying-protection means for preventing drying of the Ni—B layer formed on the substrate during the transportation of the substrate from the Ni—B plating bath to the Ni—P plating bath,
- wherein the drying-protection means comprises a cooler for cooling the Ni—B layer.
Dependencies are inferred from the claim text.