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US 6,555,170 B2Granted
Pre-plate treating system
AssigneeDuratech Industries, Inc.
InventorJames M. Taylor
Life of this patent
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Abstract
The invention relates in general to a method of electroplating substrates where at least a portion of the substrate is coated with a solution containing a film forming amine and sufficient acid to produce a pH of less than 6.5. The acid helps to clean the surface of the substrate, and the film forming amine forms a film on the surface of the substrate. Electroplating proceeds with greatly improved speed and efficiency, especially in low current areas.
Claims24
A method of electroplating a substrate comprising:
- providing a solution comprising from about 0.0003% to about 30% of a film forming amine and sufficient acid to produce a pH of less than about 6.5;
- coating at least a portion of the substrate with the solution, thereby forming a film on the substrate, wherein said film inhibits oxidation of said substrate;
- and
- plating the substrate.
1 more element
A method of electroplating a substrate comprising:
- providing a solution comprising from about 0.0003% to about 30% of a film forming amine and sufficient acid to produce a pH of less than about 6.5, the solution comprising hydrochloric acid;
- coating at least a portion of the substrate with the solution, thereby forming a film on the substrate;
- and
- plating the substrate.
1 more element
Dependencies are inferred from the claim text.