Electron device and semiconductor device

A semiconductor device comprising a semiconductor element and a bump to be electrically connected to said semiconductor element, said solder bump being lead free solder comprising:

• Cu:
• 0˜2.0 mass %;
• In:
• 0.1˜7.0 mass %;
• and
• Sn:
• in remaining amount.

A semiconductor module having a circuit board and an electronic parts to be electrically connected to an electrode of said circuit board, wherein said circuit board and an external connection terminal to be externally connecting portion to be connected electrically being connected by soldering using a lead free solder comprising:

• Cu:
• 0˜2.0 mass %;
• In:
• 0.1˜7.0 mass %;
• and
• Sn:
• remaining amount.

A semiconductor module having a circuit board, electronic parts electrically connected to an electrode of said circuit board, and an external connection terminal of the circuit board, wherein said externap connection terminal is a lead free solder consisting essentially of:

• Cu:
• 0.1-0.7 weight %;
• In:
• 0.2-5.0 weight %;
• and
• Sn:
• remaining amount.

A semiconductor module having a circuit board, electronic parts electrically connected to an electrode of said circuit board, and an external connection terminal at the circuit board, wherein said externa connection terminal is a lead free solder consisting essentially of:

• Cu:
• 0.1-0.7 weight %;
• In:
• 0.2-5.0 weight %;
• Ag:
• 0-1.0 weight;
• and
• Sn:
• remaining amount.