Polymer remover
AssigneeShipley Company, L.L.C.
InventorJavad J. Sahbari
Life of this patent
Estimating the term…
Abstract
Compositions for the removal of polymeric material from a substrate are provided where the compositions include a polyol compound selected from (C3-C20)alkanediols, substituted (C3—C20)alkanediols, (C3-C20)alkanetriols or substituted (C3-C20)alkanetriols, a glyco ether, at least 5% wt water based on the total weight of the composition, and a fluoride salt selected from ammonium fluoride, ammonium bifluoride, ammonium-tetramethylammonium bifluoride or mixtures thereof. Methods of removing polymeric material using these compositions are also provided.
Claims14
A method for removing one or more polymeric materials from an integrated circuit wherein the integrated circuit comprises one or more metals and one or more dielectric materials:
- comprising the steps of contacting the integrated circuit comprising one or more polymeric materials to be removed with a composition comprising one or more polyol compounds selected from the group consisting of (C3-C20)alkanediols, substituted (C3-C20)alkanediols, (C3-C20)alkanetriols and substituted (C3-C20)alkanetriols, one or more glycol ethers, water, and a fluoride salt mixture comprising ammonium fluoride and ammonium bifluoride for a period of time sufficient to remove the polymeric material and rinsing the integrated circuit, wherein the water is present in the composition in an amount of at least 5% wt based on the total weight of the composition.
A method for removing polymeric material from magnetic thin film heads comprising the steps of contacting a magnetic thin film head containing one or more polymeric materials to be removed with a composition comprising one or more polyol compounds selected from the group consisting of (C3-C20)alkanediols, substituted (C3-C20)alkanediols, (C3-C20)alkanetriols and substituted (C3-C20)alkanetriols, one or more glycol ethers, water, and a fluoride salt mixture comprising ammonium fluoride and ammonium bifluoride for a period of time sufficient to remove the polymeric material and rinsing the magnetic thin film head, wherein the water is present in the composition in an amount of at least 5% wt based on the total weight of the composition.
A method for removing polymeric material from a substrate comprising the steps of:
- contacting a substrate containing polymeric material to be removed with a composition comprising one or more polyol compounds selected from the group consisting of (C3-C20)alkanediols, substituted (C3-C20)alkanediols, (C3-C20)alkanetriols and substituted (C3-C20)alkanetriols, one or more glycol ethers, water, and a fluoride salt mixture comprising ammonium fluoride and ammonium bifluoride for a period of time sufficient to remove the polymeric material;
- and rinsing the substrate, wherein the water is present in the composition in an amount of at least 5% wt based on the total weight of the composition.
A method for removing polymeric material from a substrate comprising the steps of:
- contacting a substrate containing polymeric material to be removed with a composition consisting essentially of one or more polyol compounds selected from the group consisting of (C3-C20)alkanediols, substituted (C3-C20)alkanediols, (C3-C20)alkanetriols and substituted (C3-C20)alkanetriols, one or more glycol ethers, water, a fluoride salt mixture comprising ammonium fluoride and ammonium bifluoride and optionally one or more additives selected from the group consisting of corrosion inhibitors, surfactants and co-solvents, for a period of time sufficient to remove the polymeric material;
- and rinsing the substrate, wherein the water is present in the composition in an amount of at least 5% wt based on the total weight of the composition.
Dependencies are inferred from the claim text.