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US 6,554,909 B1Granted
Process for cleaning components using cleaning media
AssigneeSaint-Gobain Ceramics & Plastics, Inc.
InventorsAndrew G. Haerle, Edward A. Perry
Life of this patent
Estimating the term…
Abstract
A method for cleaning a semiconductor processing component is provided. The process calls for directing a stream of cleaning media at a surface of the component, the cleaning media including zirconia. After cleaning with the cleaning media, frozen CO2 (dry ice) pellets may be directed at the surface to further clean the component.
Claims34
A method for cleaning a semiconductor processing component, comprising:
- directing a stream of cleaning media at a surface of the component to remove material from the surface of the component, the cleaning media comprising zirconia;
- directing a flow of frozen CO2 pellets against the surface of the component, wherein the flow of frozen CO2 pellets removes particles remaining on the surface of the component after directing the stream of cleaning media at the surface;
- and
- packaging the component in a sealed package.
1 more element
A method for cleaning a semiconductor processing component, comprising:
- directing a stream of cleaning media at a surface of the component to remove material from the surface of the component, the cleaning media comprising zirconia;
- directing a flow of frozen CO2 pellets against the surface of the component, wherein the flow of frozen CO2 pellets removes particles remaining on the surface of the component after directing the stream of cleaning media at the surface;
- and
- packaging the component in a sealed package for storage and transport after directing the flow of frozen CO2 pellets against the surface, wherein the component is removed from the packaging and used in a semiconductor fabrication process without an additional cleaning step after removal from the sealed package.
1 more element
Dependencies are inferred from the claim text.