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AssigneesInternational Business Machines Corporation, Hamai Co., Ltd.
InventorsHideo Ohkuma, Satoshi Maruyama, Kiyoshi Tomiki, Makoto Fujikawa, Tomohito Johnai, Yutaka Kunii, Kazuhiko Toyoda
Estimating the term…
An abrading machine and abrading method are provided which permit a workpiece to be abraded without damage even in the case of heavy stock removal. A work holding member for mechanical abrasion includes a first holding member with a hole for receiving a workpiece and which transmits external drive force to the workpiece, and a second holding member placed on the first holding member and also having a hole for receiving the workpiece. The second holding member is removed after a predetermined volume of stock is abraded away; the workpiece is then abraded to a target thickness while being held by the first holding member alone. Thicknesses t1 and t2 of the first and second holding members are given by T1>t1+t2 and (½)T2≦t1, where T1 and T2 represent the workpiece thickness before and after abrasion, respectively.
A work holding member for mechanical abrasion of a workpiece, the thickness of said workpiece before and after mechanical abrasion being given by T1 and T2 respectively, the work holding member comprising:
A method for abrading a workpiece held between an upper plate and a lower plate, said method comprising:
A method for abrading a workpiece, the method comprising:
An abrading machine, comprising:
Dependencies are inferred from the claim text.
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From the US filing history. Foreign family members aren’t listed.
For grinding end-faces, e.g. of gauges, rollers, nuts, piston rings: for simultaneously grinding opposite and parallel end faces, e.g. double disc…
Machines or devices designed for grinding or polishing optical surfaces on lenses or surfaces of similar shape on other work; Accessories…
Work supports, e.g. adjustable steadies: radially supporting workpieces
Machines, devices, or processes for grinding or polishing
Term ended 31 Jan 2022 (estimated)
The present invention relates to an abrading method and abrading machine suitable for abrading liquid crystal cells for liquid crystal displays.
In recent years, rectangular thin glass substrates 0.5 mm to 1.5 mm thick have been used for flat displays such as liquid crystal displays. Precise flatness is required of these substrates. Glass substrates molded by standard industrial processes contain minute surface imperfections, waviness and irregularities. Such substrates are not flat enough to be used in flat displays without further processing. Generally, therefore, the surfaces of molded glass substrates are abraded to a desired flatness on an abrading machine.
In a liquid crystal display, a liquid crystal material is encapsulated between a pair of glass substrates forming a liquid crystal cell. One of the glass substrates is a color filter substrate while the other is a TFT (Thin Film Transistor) array substrate. Liquid crystal cells tend to become increasingly thin as the weight of liquid crystal displays is reduced. In order to obtain a thin liquid crystal cell, the liquid crystal cell is typically abraded by using a double-sided abrading machine until the color filter substrate and the TFT array substrate are laminated, that is, abraded to a desired thickness after forming the liquid crystal cell.
FIG. 1 is a side view of an abrading machine according to an embodiment of the present invention.
FIGS. 2A and 2B illustrate a stack carrier according to this embodiment, where FIG. 2A is a plan view and FIG. 2B is a sectional view taken along a line X—X in FIG. 2A.
FIGS. 3A, 3B, 3C and 3D illustrate an abrading method according to the present invention.
A work holding member for mechanical abrasion according to an embodiment of the present invention, as well as an abrading machine and abrading method using such machine will be described below with reference to the drawings. In this embodiment, a liquid crystal cell is used as a workpiece.
FIG. 1 is a side view of an abrading machine 10 using a work holding member for mechanical abrasion 1 according to this embodiment. FIG. 2 illustrates the work holding member for mechanical abrasion 1 according to this embodiment, where FIG. 2A is a plan view and FIG. 2B is a sectional view taken along a line X—X in FIG. 2A. Incidentally, the same components as those of the conventional abrading machine shown in FIGS. 4 to 6 are denoted by the same reference characters as those in FIGS. 4 to 6.
First, a description will be given of the configuration of the abrading machine 10 using the work holding member for mechanical abrasion 1 according to this embodiment.