Method and apparatus for conditioning a polishing pad with sonic energy
AssigneeLam Research Corporation
InventorMichael S. Lacy
Life of this patent
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Abstract
A method and apparatus for conditioning a polishing pad is described, wherein the polishing pad has a polishing surface for polishing the semiconductor wafer, and a back surface opposed to the polishing surface. The method includes positioning a sonic energy generator adjacent to the back surface of the polishing pad, and generating sonic energy through the back surface of the polishing pad. The apparatus includes a sonic energy generator adapted to be positioned adjacent the back surface, the sonic energy generator including a transducer connected to a contact member, wherein the sonic energy generator is adapted to transmit sonic energy in a direction through the back surface and to the polishing surface of the polishing belt.
Claims24
A method for conditioning a polishing pad used in chemical mechanical planarization of a semiconductor wafer, the polishing pad having a polishing surface for polishing the semiconductor wafer, and a back surface opposed to the polishing surface, the method comprising:
- positioning a sonic energy generator adjacent to the back surface of the polishing pad;
- generating sonic energy through the back surface of the polishing pad;
- and
- moving said polishing pad past the sonic energy generator while sonic energy is generated through the back surface of the polishing pad.
A method for conditioning a polishing pad used in chemical mechanical planarization of a semiconductor wafer, the polishing pad having a polishing surface for polishing the semiconductor wafer, and a back surface opposed to the polishing surface, the method comprising:
- moving the polishing pad past a fixed source of sonic energy;
- and
- applying sonic energy to the polishing pad in a direction through the back surface and to the polishing surface of the polishing pad.
A wafer polisher for chemical mechanical planarization of a semiconductor wafer, the wafer polisher comprising:
- a polishing pad having a polishing surface for polishing a semiconductor wafer, and a back surface opposed to the polishing surface;
- and
- a pad conditioner for conditioning the polishing pad, wherein the pad conditioner includes a sonic energy generator adjacent the back surface that transmits sonic energy in a direction through the back surface and to the polishing surface of the polishing pad while the polishing pad moves past the sonic energy generator.
A wafer polisher for chemical mechanical planarization of a semiconductor wafer, the wafer polisher comprising:
- a polishing pad having a polishing surface for polishing a semiconductor wafer, and a back surface opposed to the polishing surface, wherein the polishing pad comprises a linear belt wrapped around at least two rollers, and wherein the linear belt forms a cavity;
- a pad conditioner for conditioning the polishing pad, wherein the pad conditioner transmits sonic energy in a direction through the back surface and to the polishing surface of the polishing pad while the polishing pad moves past sonic energy being transmitted in a direction through the back surface and to the polishing surface of the polishing pad.
A pad conditioner for conditioning a polishing pad having a polishing surface for polishing a semiconductor wafer, and a back surface opposed to the polishing surface, the pad conditioner comprising:
- a sonic energy generator positioned adjacent the back surface, the sonic energy generator including a transducer connected to a contact member, wherein the sonic energy generator transmits sonic energy in a direction through the back surface and to the polishing surface of the polishing pad while the polishing pad is moved past the contact member.
Dependencies are inferred from the claim text.