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US 6,554,686 B1Granted
Sawing wire and method for the cutting and lapping of hard brittle workpieces
AssigneeWacker Siltronic Gesellschaft fur Halbleitermaterialien AG
InventorsMaximilian Kaeser, Christian Andrae
Life of this patent
Estimating the term…
Abstract
A sawing wire is for the simultaneous cutting and lapping of a multiplicity of wafers from a hard brittle workpiece. The sawing wire exhibits torsion. There is also a method for cutting and lapping using the sawing wire.
Claims6
A method for the simultaneous cutting and lapping of a multiplicity of wafers from a hard brittle workpiece comprising
- simultaneously cutting and lapping of a multiplicity of wafers from a hard brittle workpiece in a wire saw with a sawing wire which runs helically over wire-guide rollers and forms a wire web, and supplying a cutting-lapping agent to the sawing wire of the wire saw;
- causing said sawing wire to execute a rotary movement during the cutting and lapping of the multiplicity of wafers from the hard brittle workpiece;
- and
- rotating the sawing wire from 1 to 10 times over a wire length of 1500 mm.
1 more element
A method for the simultaneous cutting and lapping of a multiplicity of wafers from a hard brittle workpiece comprising
- simultaneously cutting and lapping of a multiplicity of wafers from a hard brittle workpiece in a wire saw with a sawing wire which runs helically over wire-guide rollers and forms a wire web, and supplying a cutting-lapping agent to the sawing wire of the wire saw;
- causing said sawing wire to execute a rotary movement during the cutting and lapping of the multiplicity of wafers from the hard brittle workpiece;
- and
- providing said sawing wire over a wire length of 150 to 1500 mm with a torsion of 360°.
1 more element
Dependencies are inferred from the claim text.