Optical module

An optical module, comprising:

• an optical waveguide formed from a first resin, said first resin comprising fluorine;
• a section above said optical waveguide, comprising a silicone-based resin;
• and
• an inorganic film interposed between said optical waveguide and said silicone-based resin.

An optical module, comprising:

• an optical waveguide formed from a first resin, said first resin comprising fluorine;
• a section above said optical waveguide, comprising a silicone-based resin;
• and
• an intermediate resin layer comprising substantially 0% fluorine interposed between said optical waveguide and said silicone-based resin.

An optical module, comprising:

• an optical waveguide formed from a first resin, said first resin comprising fluorine;
• a section above said optical waveguide, comprising a silicone-based resin;
• and
• a second resin comprising fluorine content of less than 10% total weight interposed between said optical waveguide and said silicone-based resin.

A method for producing an optical module for use in optical communications, said method comprising:

• forming an optical waveguide comprising a resin, said resin comprising fluorine;
• forming above said optical waveguide, an intermediate layer comprising less than 10% fluorine;
• and
• forming a covering layer above said an intermediate layer, said covering layer comprising a silicone-based resin.

A method for producing an optical module for use in optical communications, said method comprising:

• forming an optical waveguide comprising a resin, said resin comprising fluorine;
• applying above said optical waveguide, an intermediate layer comprising material formed from a group consisting of a metal film, a dielectric film, or a film comprising silicon;
• and
• applying a covering layer above said optical waveguide, said covering layer comprising a silicone-based resin.

A method of sealing using a silicone based resin over a first layer, comprising fluorine, of an optical module, said method comprising:

• forming a second layer over said first layer, wherein said second layer comprises little or no fluorine;
• applying said silicon based resin over said second layer;
• and
• setting said silicon based resin by heating.

A system for producing an optical module, comprising a polymer-based optical waveguide,

• a waveguide forming module for forming said polymer-based optical waveguide, said polymer-based optical waveguide comprising a resin, said resin comprising fluorine;
• an intermediary layer module for applying a material above said polymer-based optical waveguide;
• and
• a resin sealing module for applying a silicone-based resin above said intermediary layer.

A system, comprising a plurality of processors and a plurality of memories, said plurality of memories comprising software for producing an optical module, wherein said optical module comprises an optical waveguide, said system comprising:

• an optical waveguide module for forming said optical waveguide from a first resin, said first resin comprising fluorine;
• an intermediate layer module for forming a layer above said optical waveguide;
• and
• a sealing resin module for applying a silicone-based resin above said layer.

A plurality of computer readable media for storing code for making an optical module, comprising:

• code for forming an optical waveguide from a first resin, said first resin comprising fluorine;
• code for forming an intermediary layer above said optical waveguide;
• and
• code for forming a silicone-based resin layer above said intermediary layer.

A system for making an optical module, comprising:

• means for forming an optical waveguide from a first resin, said first resin comprising fluorine;
• means for forming an intermediary layer above said optical waveguide;
• and
• means for forming a silicone-based resin layer above said intermediary layer.

An optical module, comprising:

• an optical waveguide formed from a first resin, said first resin comprising fluorine;
• an intermediary layer above said optical waveguide;
• and
• a silicone-based resin layer above said intermediary layer.