Fluid ejection device and process for the production thereof
AssigneeMatsushita Electric Industrial Co., Ltd.
InventorsKatsumasa Miki, Masaya Nakatani, Isaku Kanno, Ryoichi Takayama, Koji Nomura
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AssigneeMatsushita Electric Industrial Co., Ltd.
InventorsKatsumasa Miki, Masaya Nakatani, Isaku Kanno, Ryoichi Takayama, Koji Nomura
Estimating the term…
A fluid ejection device, such as for an ink jet printer or the like, having increased increasing nozzle density. A through-hole (15) is provided in a glass substrate (18) to which a second silicon substrate (19) is directly bonded to form an ink outlet (14). The first silicon substrate (17) is etched to form a pressure chamber (12), an ink channel (13) and an ink inlet (16), and bonded directly to the glass substrate (18). A piezoelectric thin film (11), having a conductive, elastic body (20), is bonded to the first substrate covering the pressure chamber (12). The elastic body (20) is sandwiched between the piezoelectric thin film (11) and a resin layer (25). The second substrate (19) has a thickness of less than about 0.8 mm in a range of thickness comprising about 1.2 to about 1.9 times (rg-rs), wherein rg is the diameter of the wide end of the through-hole (15) and rs is the diameter of the narrow end of the through-hole (15).
A fluid ejection device comprising;
A fluid ejection device comprising;
A fluid ejection device comprising:
The fluid ejection device comprising:
Dependencies are inferred from the claim text.