Device for thermally, stably supporting a miniaturized component

A device for supporting a miniaturized component, comprising a first part (3, 20) formed with a base (21) having a convex surface and a first and a second flaps (24, 24′) arranged upright on said base (21), wherein a first fixing point (13) for a second part (12, 26) is arranged on said first flap (24) and a second fixing point (13′, 29) for said second part (12, 26) is arranged on said second flap (24′), and

• said second part (12, 26) supports the component (28), said second part (12, 26) being fixed to the first part (3, 20) between said first and second flaps (24, 24′) at said first and second fixing points (13, 13′, 29) of each of said first and second flaps (24, 24′) on opposite sides of the second part (12, 26), and a support (17, 27) for the component (28) is arranged on said second part (12, 26), wherein (i) the position of said support (17, 27) on the second part (12, 26) is chosen related to the first and second fixing points (13, 13′, 29) between the first (3, 20) and the second (12, 26) parts, and (ii) a first material of the first part (3, 20) has a specific coefficient of thermal expansion α1 and a second material of the second part (12, 26) has a specific coefficient of thermal expansion α2 such that an influence of a thermal expansion of the first part (3, 20) on a position of the support (17, 27) of the component (28) relative to the base (21) is at least partly compensated by an influence of a thermal expansion of the second part (12, 26).