IC card and its manufacturing method

An IC chip manufacturing process, comprising:

• forming a circuit on a first wafer surface;
• forming a protection agent over said first wafer surface;
• grinding a second wafer surface on a back side of the first wafer surface to form a thinner thickness of the wafer than that of before the grinding;
• dicing said wafer to form said IC chip, said wafer having sharp portions on the second surface due to the grinding;
• etching said IC chip on which said protection agent is formed;
• removing said protection agent from said IC chip, wherein the second wafer surface and a third surface formed by said dicing are etched to form rounded portions from sharp portions on said second surface that resulted from said grinding and from chipping flaws on said third surface that resulted from said dicing.

An IC card manufacturing process, comprising:

• forming a circuit on a first wafer surface;
• forming a protection agent on said first wafer surface;
• grinding a second wafer surface on a back side of the first wafer surface to form a thinner thickness of the wafer than that of before the grinding;
• dicing said wafer to form said IC chip, said wafer having sharp portions on the second surface due to the grinding
• etching said IC chip on which said protection agent is formed;
• and
• removing said protection agent from said IC chip,
• wherein the second surface and a third surface formed by said dicing are etched to form rounded portions from sharp portions on said second surface that result from said grinding and from chipping flaws on said third surface that resulted from said dicing;
• fitting said IC chip between base layers of said card and securing said layers together with an adhesive.