Smart card with replaceable chip

A card comprising:

• a card body having:
• a front face;
• a back face;
• an edge;
• a cut-out portion extending at least partially through said front face intersecting at least a portion of said edge defining an opening in said edge;
• and
• a laminate formed on said back face covering said cut-out portion
• a semiconductor chip assembly having a semiconductor device positioned thereon, said semiconductor chip assembly being insertable within said cut-out portion through said opening such that at least a portion of said semiconductor chip assembly defines a portion of the card body periphery.

A method of forming a card comprising:

• providing a card body;
• forming a cut-out portion in a top face of said card body extending at least partially therethrough, said cut-out portion intersecting at least a portion of an edge of said card body defining an opening in said edge of said card body;
• forming a first locking member within said cut-out portion;
• providing a semiconductor chip assembly having a semiconductor device formed thereon;
• forming a corresponding second locking member on said semiconductor chip assembly;
• and
• sliding said semiconductor chip assembly into said cut-out portion through said opening such at least a portion of said semiconductor chip assembly defines a portion of the card body periphery and said semiconductor chip assembly is locked within said cut-out portion of said card body as said first locking member engages said second locking member.

A card comprising:

• a card body having:
• a cut-out portion extending partially through said card body, said cut-out portion intersecting at least a portion of an edge of said card body defining an opening in said edge of said card body;
• a first locking member within said cut-out portion;
• and,
• first and second grooves formed on opposing sides of said cut-out portion;
• and,
• a semiconductor chip assembly having:
• a semiconductor device positioned thereon;
• a corresponding second locking member;
• and,
• first and second projections extending along opposing sides thereof;
• wherein said semiconductor chip assembly is insertable within said cut-out portion through said opening such that said first and second projections engage corresponding ones of said first and second grooves, and said first locking member engages said second locking member.