Reduction of plasma edge effect on plasma enhanced CVD processes
AssigneeApplied Materials, Inc.
InventorsKuo-Shih Liu, Ramana Veerasingam, Zhi Xu, Ping Xu, Mario Dave Silvetti, Gang Chen
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AssigneeApplied Materials, Inc.
InventorsKuo-Shih Liu, Ramana Veerasingam, Zhi Xu, Ping Xu, Mario Dave Silvetti, Gang Chen
Estimating the term…
An appparatus for confining plasma within a process zone of a substrate processing chamber. In one aspect, an apparatus comprises an annular member having an upper mounting surface, an inner confinement wall, and an outer confinement wall. The apparatus is disposed on or otherwise connected to a gas distribution assembly of the processing chamber to prevent plasma edge effects on the surface of a substrate. The apparatus provides a plasma choke aperture that reduces the volume of the process zone around the periphery of the substrate thereby eliminating uneven deposition of material around the edge of the substrate.
An apparatus for confining a plasma within a processing chamber, comprising:
An apparatus for distributing a process gas within a substrate processing chamber, comprising:
An apparatus for confining a plasma within a processing chamber, comprising:
An apparatus for distributing a process gas within a substrate processing chamber, comprising:
A processing chamber, comprising:
A processing chamber, comprising:
An apparatus for distributing a process gas within a substrate processing chamber, comprising:
A processing chamber, comprising:
An apparatus for distributing a process gas within a substrate processing chamber, comprising:
Dependencies are inferred from the claim text.