Semiconductor test structure having a laser defined current carrying structure
AssigneeTexas Instruments Incorporated
InventorsRichard W. Arnold, Lester Wilson, James Forster
Life of this patent
Estimating the term…
Loading patent…
AssigneeTexas Instruments Incorporated
InventorsRichard W. Arnold, Lester Wilson, James Forster
Estimating the term…
A test structure that is readily and inexpensively configurable to interface with dies having different bond pad configurations is achieved by providing a blank test membrane having a conductive coating or a matrix of conductive lines formed thereon. Once a die bond pad configuration is known, the test membrane can be configured for the die bond pads by using a laser under software control to define connection pads correlating to the die bond pads and also to define interconnecting conductive traces from the connecting pads to contact pads that can be connected to test equipment. In one embodiment, the laser operates to ablate a continuous conductive coating, so as to form conductive pads and traces. In another embodiment, the laser is used to cut various lines in a matrix of conductive lines, so as to define conductive paths from the bond pads to the contact pads for connection to the test equipment.
A method of forming a test structure for interfacing to test equipment a semiconductor die having bond pads at predefined coordinates using a machine controlled laser, the test equipment having contact points at predefined locations, comprising:
A method for forming a test structure for interfacing test equipment to a semiconductor die, comprising the steps of:
A method for forming a test structure for interfacing test equipment to a semiconductor die, comprising the steps of:
Dependencies are inferred from the claim text.