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US 6,553,658 B2Granted
Assembling a stacked die package
AssigneeMicron Technology, Inc.
InventorPatrick W. Tandy
Life of this patent
Estimating the term…
Abstract
A method for assembling a multi-chip module does not necessitate more than one pass through a die attach machine. The method involves attaching a smaller die to a larger die without using a die attach machine. The larger die may be attached to a support structure using a die attach machine.
Claims10
A method of making a multi-chip module comprising:
- positioning a first, relatively smaller die on a second, relatively larger die;
- positioning the larger die on a support structure;
- and
- securing the smaller die to the larger die and securing said larger die to a support structure by way of a single pass through a die attach machine.
1 more element
Dependencies are inferred from the claim text.