US 6,553,318 B2Granted

Method for conducting sensor array-based rapid materials characterization

AssigneeSymyx Technologies, Inc.

InventorPaul Mansky

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Abstract

There is disclosed a material characterization method. The method may include any combination of several potential steps. According to one of the steps multiple material samples are applied to multiple sensors in an array of sensors. In another step, one or more of the sensors of the array are electrically contacted. In another step, electrical connections are formed between selected sensors and electronic test and measurement apparatus. In another step, electric signals are sent to and received from the sensors in the array wherein the signals correspond to thermal, electrical, mechanical or other properties of the material samples. Preferably, some of the equipment (e.g., the electrical connections) used in the method are standardized to allow equipment such as sensor arrays to be interchangeable with equipment such as the electronic test and measurement apparatus.

Claims20

Dependent claims

A method for characterizing a plurality of materials, comprising the steps of:

a) providing 5 to 400 sensors on a first array, each of said sensors being adapted for receiving a test sample of a material and each of said sensors being adapted for measuring a same first material property as each other sensor;
b) connecting said first array to an interconnection device associated with electronic test circuitry for electrical communication between said first array and said electronic test circuitry;
c) depositing a different individual material test sample onto each of said sensors,
d) routing an electrical input signal to each of said sensors having a material test sample thereon;
e) measuring a resulting electrical output signal from each of said sensors having a material test sample thereon;
f) correlating any difference between said electrical input signal and said electrical output signal with said same first material property being tested;
g)removing said first array;
h) repeating said steps (a)-(f), substituting a second array of 5 to 400 sensors for said first array, each of said sensors in said second array being adapted for receiving a test sample of a material and each of said sensors of said second array being adapted for measuring a same second material property as each other sensor by way of said interconnection device.

5 more elements

A method for characterizing a plurality of materials, comprising the steps of:

a) providing 5 to 400 sensors on a first array lithographically formed on a first substrate, each of said sensors being adapted for receiving a test sample of a material and each of said sensors being adapted for measuring common first material property or properties as each other sensor;
b) connecting said first array to an interconnection device associated with electronic test circuitry for electrical communication between said first array and said electronic test circuitry;
c) depositing a different individual material test sample onto each of said sensors;
d) routing an electrical input signal with a multiplexer to each of said sensors having a material test sample thereon;
e) measuring a resulting electrical output signal from each of said sensors having a material test sample thereon;
f) correlating any difference between said electrical input signal and said electrical output signal with said common first material property being tested;
g) removing said first array;
h) repeating said steps (a)-(f), substituting for said first array a second array of 5 to 400 sensors lithographically formed on a second substrate, each of said sensors in said second array being adapted for receiving a test sample of a material and each of said sensors being adapted for measuring common second material property or properties as each other sensor by way of said interconnection device.

5 more elements

A method for characterizing a plurality of materials, comprising the steps of:

a) providing 5 to 400 sensors on a first array lithographically formed on a first substrate and having a first sensor contact pad format with a plurality of contact pads, each of said sensors being adapted for receiving a test sample of a material and each of said sensors being adapted for measuring common first material property or properties as each other sensor;
b) connecting said first array to a printed circuit board having electrical traces defined therein adapted for communicating with said plurality of contact pads of said sensors and for connecting to a multi-pin connector disposed near an edge of said printed circuit board;
c) connecting said printed circuit board via said multi-pin connector to an interconnection device associated with electronic test circuitry for electrical communication between said first array and said electronic test circuitry;
d) depositing a material test sample onto each of said sensors with an automated dispenser;
e) routing an electrical input signal with a multiplexer to each of said sensors having a material test sample thereon;
f) measuring a resulting electrical output signal from each of said sensors having a material test sample thereon;
g) correlating with a computer any difference between said electrical input signal and said electrical output signal with said common first material property being tested;
h) removing said first array and disposing of said first array;
i) repeating said steps (a)-(h), substituting for said first array a second array of 5 to 400 sensors lithographically formed on a second substrate and having a second sensor contact pad format, with a plurality of contact pads, which is the same as said first sensor contact pad format, each of said sensors in said second array being adapted for receiving a test sample of a material and each of said sensors being adapted for measuring common second material property or properties as each other sensor by way of said interconnection device.

6 more elements

Dependencies are inferred from the claim text.

Facts

Application: 09/858,048Filed 15 May 2001 · continuation
Priority: 11 Dec 1998
Published: US 2002/0028456 A17 Mar 2002
Granted: 22 Apr 2003
Term ends: Not estimatedThe source records don’t support an estimate.

Classification17 codes

G01N 25/18
Investigating or analyzing materials by the use of thermal means: by investigating thermal conductivity
B01J 19/0046
Chemical, physical or physico-chemical processes in general; Their relevant apparatus: sequential or parallel reactions, e.g. for the synthesis of…
G01N 25/005
Investigating or analyzing materials by the use of thermal means: by investigating specific heat
B01J 2219/00605
Making arrays on substantially continuous surfaces: the compounds being directly bound or immobilised to solid supports