BGA heat ball plate spreader, BGA to PCB plate interface

An arrangement of components, comprising:

• an integrated circuit package;
• a printed circuit board to which the integrated circuit package is mounted;
• and
• a first heat sink disposed in thermally conductive and physical contact between the integrated circuit package and the printed circuit board, the first heat sink comprising a first thermally conductive solid layer having bumps which contain a first thermally conductive flowable material, the first heat sink further comprising a second thermally conductive solid layer in which the second thermally conductive solid layer is bonded to the printed circuit board and is thermally conductively coupled to the first thermally conductive solid layer.

A heat dissipation structure for placement between an integrated circuit chip and a circuit board, comprising:

• a first layer of thermally conductive bumps capable of being placed in thermally conductive and physical contact with an underside of an integrated circuit chip;
• a first solid, thermally conductive, and planar plate being placed in thermally conductive and physical contact with the underside of the first layer of thermally conductive bumps, and planar plate;
• and
• a second layer of thermally conductive bumps being in thermally conductive and physical contact with the first solid, thermally conductive, and planar plate, the second layer of thermally conductive bumps being disposed on an underside of the first solid, thermally conductive, and planar plate, the second layer of thermally conductive bumps capable of being in thermally conductive and physical contact with a circuit board.

A heat dissipation structure for an integrated circuit that is capable of being placed between an integrated circuit and a printed circuit board, comprising:

• a layer of bump material capable of being placed in direct physical and thermally conductive contact with an underside of an integrated circuit;
• a first solid, thermally conductive, and flat layer in direct physical and thermally conductive contact with an underside of the layer of bump material;
• and
• a second solid, thermally conductive, and flat layer in direct physical and thermally contact with an underside of the first solid, thermally conductive, and flat layer, the second solid, thermally conductive, and flat layer capable of being mounted in direct physical and thermally conductive contact with a printed circuit board.