Apparatus and system for cooling electronic circuitry, heat sinks, and related components

A system for cooling an electrical component comprising:

• at least one electrical component,
• a heat sink having at least one interior passageway formed therein and a plurality of other passageways connecting said interior passageway to the exterior surface of said heat sink;
• said electrical component and said heat sink arranged to form a chamber that may be filled with pressurized cooling fluid between said electrical component and said heat sink;
• said interior passageway in said heat sink connected to said chamber;
• means for supplying pressurized cooling fluid capable of phase change to said chamber to flow through said interior passageways in said heat sink to conductively cool the interior of said heat sink and evaporatively cool the exterior surface of said heat sink;
• and
• means for collecting and recycling said cooling fluid.

A system for cooling an electrical component comprising:

• at least one electrical component having at least a first and second surface and at least one interior passageway formed therein;
• said interior passageway in said component leading from said first surface to said second surface;
• means for supplying a cooling fluid capable of phase change to said interior passageway in said component to conductively cool the interior of said component evaporatively cool the exterior surface of said component;
• an environmental housing having an interior surface for containing and collecting the cooling fluid;
• and
• heat sink material located between the component and said environmental housing.

A system for cooling an electronic component comprising:

• at least one electronic component;
• a heat sink attached to said at least one electronic component;
• said heat sink having at least one interior passageway within said heat sink and at least one secondary passageway in fluid communication with said at least one interior passageway connecting said interior passageway to an exterior surface of said heat sink;
• means for supplying cooling fluid capable of phase change to said interior passageway;
• means for adjusting the rate at which said cooling fluid passes through said interior passageway so that substantially no cooling fluid is vaporized within said interior passageway;
• and
• means for collecting and recycling said cooling fluid.

A system for cooling an integrated circuit board and its components comprising:

• a cooling manifold having a surface for receiving at least one circuit board, die, or heat sink;
• said cooling manifold having at least one interior passageway therein;
• said interior passageway connected to the surface of said cooling manifold;
• means for supplying pressurized cooling fluid capable of phase change to said interior passageway to conductively cool said cooling manifold and to flow through said interior passageway to the surface of said cooling manifold to cool the exterior surface of said cooling manifold at least partially by evaporative cooling;
• means for adjusting the rate at which said cooling fluid passes through said interior passageway so that substantially no cooling fluid is vaporized within said interior passageway;
• means for collecting and recycling said cooling fluid.