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US 6,552,898 B1Granted
Fan duct module
AssigneeIntel Corporation
InventorScott L. Noble
Life of this patent
Estimating the term…
Abstract
A cooling assembly is disclosed. In one embodiment, the cooling assembly includes a fan for use to direct cool air onto heat dissipating electronic components, and a linear air guiding duct-housing combination for use to house the fan and to guide the cool air to the fan. The linear air guiding duct-housing combination is constituted with material(s) and/or structural supports that allow the cooling assembly to be mounted in a cantilever manner against a chassis wall of a chassis, overhanging the heat dissipating electronic components. In one embodiment, the cooling assembly further includes an air hood coupled to the linear air guiding duct-housing combination to facilitate in-take of cool air from a direction angular to the linear air guiding duct-housing combination.
Claims44
A cooling assembly comprising:
- (a) a fan to direct cool air onto heat dissipating electronic components within a chassis;
- and
- (b) an air guiding duct-housing combination coupled to the fan to guide cool air to the fan, the air guiding duct-housing combination having cantilever structural supports to allow the cooling assembly to be mounted at one end against a chassis wall of the chassis, overhanging the heat dissipating electronic components.
A computer system comprising:
- (a) a processor;
- (b) a plurality of memory modules;
- (c) a chassis housing the processor and the plurality of memory modules, the chassis having a chassis wall;
- and
- (d) a cooling assembly mounted against the chassis wall in a cantilever manner overhanging over the processor and the memory modules to direct cool air onto the processor and the memory modules to cool the processor and the memory modules, the cooling assembly having
- (d.1) a fan for use to direct the cool air onto the processor and the memory modules;
- and
- (d.2) a air guiding duct-housing combination for use to house the fan and to guide the cool air to the fan, the air guiding duct-housing combination being constituted with material(s) and/or structural supports that allow the assembly to be mounted in the cantilever manner.
5 more elements
An apparatus comprising:
- (a) a plurality of heat dissipating electronic components;
- (b) a chassis having a plurality of chassis walls to house the electronic components;
- (c) a cooling assembly mounted against one of the chassis walls in a cantilever manner overhanging over the electronic components to direct cool air onto the electronic components to cool the electronic components, the cooling assembly having
- (c.1) a fan for use to direct the cool air onto the electronic components;
- and
- (c.2) a linear air guiding duct-housing combination for use to house the fan and to guide the cool air to the fan, the linear air guiding duct-housing combination being constituted with material(s) and/or structural supports that allow the assembly to be mounted in the cantilever manner.
3 more elements
A cooling assembly comprising:
- a fan coupled with an air-guiding duct to pull and deliver cool air into an enclosure using the air-guiding duct, wherein the enclosure is formed by fastening a base to a computer system board comprising electronic components comprising a processor and other electronic components;
- the air-guiding duct comprising a channel to guide the cool air into the enclosure to directly and unrestrictedly provide the cool air to the processor and the other electronic components;
- and
- the base to couple and position the fan and the air-guiding duct over the processor and the other electronic components.
1 more element
A cooling apparatus comprising:
- a modular fan coupled with a modular air-guiding duct to pull and deliver cool air into an enclosure using the air-guiding duct, wherein the enclosure is formed by fastening a modular base to a computer system board comprising electronic components comprising a processor and one or more other electronic components;
- the modular air-guiding duct comprising a channel to guide the cool air into the enclosure to directly and unrestrictedly provide the cool air to the processor and the one or more other electronic components;
- and
- the modular base to couple and position the modular fan and the modular air-guiding duct over the processor and the one or more other electronic components.
1 more element
A method comprising:
- receiving fresh air into a first input opening of an air-guiding duct;
- guiding the fresh air from the first input opening to an input side of a fan using an enclosed channel of the air-guiding duct;
- delivering the fresh air from the input side of the fan through a second input opening of a base opening directly and unrestrictedly to a processor and other electronic components in a substantially perpendicular direction.
A computer system comprising:
- a processor;
- other electronic components;
- and
- a cooling apparatus comprising:
- a fan coupled with an air-guiding duct to pull and deliver cool air into an enclosure using the air-guiding duct, wherein the enclosure is formed by fastening a base to a computer system board comprising the processor and the other electronic components;
- the air-guiding duct comprising a channel to guide the cool air into the enclosure to directly and unrestrictedly provide the cool air to the processor and the other electronic components;
- and
- the base to couple and position the fan and the air-guiding duct over the processor and the other electronic components.
5 more elements
An apparatus comprising:
- means for pulling and delivering cool air into an enclosure using an air-guiding duct, wherein the enclosure is formed by fastening a base to a computer system board comprising electronic components comprising a processor and other electronic components;
- means for guiding the cool air into the enclosure using a channel to directly provide the cool air to the processor and the other electronic components;
- and
- means for coupling and positioning a fan and the air-guiding duct over the processor and the other electronic components.
1 more element
A method comprising the steps of:
- a step for receiving fresh air into a first input opening of an air-guiding duct;
- a step for guiding the fresh air from the first input opening to an input side of a fan using an enclosed channel of the air-guiding duct;
- a step for delivering the fresh air from the input side of the fan through a second input opening of a base opening directly and unrestrictedly to a processor and other electronic components in a substantially perpendicular direction.
Dependencies are inferred from the claim text.