Semiconductor device and fabrication method thereof
AssigneeShinko Electric Industries Co., Ltd.
InventorsTomoharu Fujii, Shigeru Okamura, Tsutomu Higuchi, Masatoshi Akagawa
Life of this patent
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Abstract
A semiconductor device with an antenna including one or more antenna units for sending and receiving signals and a semiconductor element electrically connected to the antenna units, wherein the antenna units are formed by pressing or etching a thin metal sheet with substantially the same flat surface size as the semiconductor element, and the antenna units are integrally coupled to the surface of the semicondcutor element. The antenna units are formed in a plurality of layers separated by insulating layers, and the antenna units formed on the respective layers are connected electrically in series with each other.
Claims20
A semiconductor device with an antenna, comprising:
- one or more antenna units for sending and receiving signals and a semiconductor element electrically connected to said antenna units,
- wherein said antenna units are formed with substantially a same flat surface size as said semiconductor element,
- wherein each of said antenna units includes connecting terminals protruding from a lower surface thereof,
- wherein said antenna units are integrally coupled to the surface of said semiconductor element by electrically connecting the connecting terminals of the antenna units with the semiconductor element,
- wherein said semiconductor element surface defines an area, and
- wherein the size of each of said antenna units is dimensioned to be received within the area.
A method of fabricating a semiconductor device with an antenna, comprising one or more antenna units for sending and receiving signals and a semiconductor element electrically connected with said antenna units,
- comprising the steps of forming a plurality of semiconductor elements at predetermined positions on a semiconductor wafer, forming an antenna frame having a plurality of antenna units at positions corresponding to said predetermined positions, and setting said semiconductor wafer and said antenna frame in register with each other in opposed relation to each other in accordance with the positions of said semiconductor elements and said antenna units, coupling by connecting each of said semiconductor elements and the corresponding antenna units with each other electrically, and cutting off said semiconductor wafer and said antenna frame to profile of each of said semiconductor devices.
A method of fabricating a semiconductor device with an antenna, comprising one or more antenna units for sending and receiving signals and a semiconductor element electrically connected with said antenna units,
- comprising the steps of forming a plurality of semiconductor elements at predetermined positions on a semiconductor wafer, forming antenna frames, each of which has a plurality of antenna units at the positions corresponding to said predetermined positions, forming a multilayered member by integrating said antenna frames, each of which is separated by an adhesive film, and by connecting antenna units of said antenna frames electrically in series with each other, and setting said semiconductor wafer and said multilayered member in register with each other in an opposed relation to each other in accordance with the positions of said semiconductor elements and said antenna units, coupling by connecting each of said semiconductor elements and the corresponding antenna units with each other electrically, and cutting off said semiconductor wafer and said multilayered member to profile of each of said semiconductor devices.
Dependencies are inferred from the claim text.