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US 6,552,555 B1Granted
Integrated circuit testing apparatus
AssigneeCustom One Design, Inc.
InventorsPeter R. Nuytkens, Lev Bromberg, Patrick G. Dannen, Andrew D. Miller, Ahmed Mitwalli, Robert A. Most
Life of this patent
Estimating the term…
Abstract
An integrated circuit testing apparatus includes a probe card and a probe unit. The probe unit includes a plurality of conductive elastic bumps and a plurality of conductors positioned to conduct signals from the bumps to the probe card. The testing apparatus can further includes a substrate disposed between the probe card and the probe unit, and a flexible member disposed adjacent the substrate.
Claims29
An integrated circuit testing apparatus comprising:
- a probe card;
- and
- a probe unit comprising a plurality of conductive elastomeric bumps and a plurality of conductors positioned to conduct signals from the bumps to said probe card;
- wherein the probe card is in electrical communications with the plurality of conductive elastomeric bumps through a via which extends through a substrate supporting the bumps;
- further comprising a flexible member disposed adjacent the substrate and a flexible conductor disposed within the flexible member for communication with the via.
2 more elements
An integrated circuit testing apparatus comprising:
- a probe card;
- and
- a probe unit comprising a plurality of conductive elastomeric bumps and a plurality of conductors positioned to conduct signals from the bumps to said probe card;
- wherein the probe,unit further comprises a plurality of ground pads disposed between a plurality of striplines and the bumps, where each stripline is connected to a respective bump;
- wherein one of the plurality of striplines forms a laser trimmable flange of a waveguide.
2 more elements
An integrated circuit testing apparatus comprising:
- a probe card;
- and
- a probe unit comprising a plurality of conductive elastomeric bumps and a plurality of conductors positioned to conduct signals from the bumps to said probe card;
- further comprising a substrate disposed between the probe card and the probe unit;
- wherein the probe unit further comprises one of an active or a passive component embedded within the probe unit.
2 more elements
An integrated circuit testing apparatus comprising:
- a probe card;
- and
- a probe unit comprising a plurality of conductive bumps and a plurality of conductors positioned to conduct signals from the bumps to said probe card;
- wherein the probe card is in electrical communications with the plurality of conductive bumps through a via which extends through a substrate supporting the bumps;
- further comprising a flexible member disposed adjacent the substrate and a flexible -conductor disposed within the flexible member for communication with the via.
2 more elements
An integrated circuit testing apparatus comprising:
- a probe card;
- and
- a probe unit comprising a plurality of conductive bumps and a plurality of conductors, including striplines, positioned to conduct signals from the bumps to said probe card;
- wherein the probe unit further comprises a plurality of ground pads disposed between a plurality of striplines and the bumps, where each stripline is connected to a respective bump;
- wherein at least one of the plurality of striplines forms a laser trimmable flange of a waveguide.
2 more elements
An integrated circuit testing apparatus comprising:
- a probe card;
- and
- a probe unit comprising a plurality of conductive bumps, and
- a plurality of muti-layed waveguides, with laser trimmable flanges which permit tuneabillty, to conduct signals to said conductive bumps.
1 more element
An integrated circuit testing apparatus comprising:
- a probe card;
- and
- a probe unit comprising a plurality of conductive bumps and a plurality of conductors positioned to conduct signals from the bumps to said probe card;
- further comprising.a substrate disposed between the probe card and the probe unit;
- wherein the probe unit further comprises one of an active or a passive component embedded within the probe unit.
2 more elements
An integrated circuit testing apparatus comprising:
- a probe card;
- and
- a probe unit comprising a plurality of conductive bumps and a plurality of conductors positioned to conduct signals from the bumps to said probe card;
- further comprising a substrate disposed between the probe card and the probe unit;
- wherein the probe unit further comprises:
- an active or a passive component mounted on the probe unit;
- and
- an elastomeric layer between said passive component and said probe card to compensate for surface variations caused by component.
5 more elements
An integrated circuit testing apparatus comprising:
- a probe card;
- and
- a probe unit comprising a plurality independently mobile sections, each comprised of at least one contact bump;
- a flexible member supporting the plurality of said sections, so as to allow each section to move independently to compensate for differences of height of circuitry being tested.
1 more element
An integrated circuit testing apparatus comprising:
- a probe card;
- a probe unit including:
- a plurality of conductive contact bumps;
- and
- a plurality of voltage equilibrating sites around each of the plurality of bumps, each equilibrating site including:
- a first conductor encircling an associated contact bump;
- a conductor for supplying voltage to the first conductor separately from voltage supplied to the contact bump;
- circuitry for sensing the static voltage on a device to be tested by contact with said probe unit and for placing a corresponding voltage on said first conductors.
5 more elements
An integrated circuit testing apparatus comprising:
- a probe card;
- and
- a probe unit comprising a plurality of conductive bumps and a plurality of conductors positioned to conduct signals from the bumps to said probe card;
- wherein said contact bumps have been polished with diamond dust.
1 more element
An integrated circuit testing apparatus comprising:
- a probe card;
- and
- a probe unit comprising a plurality of conductive bumps and a plurality of conductors positioned to conduct signals from the bumps to said probe card;
- wherein said contact bumps have been polished with silver dust.
1 more element
An integrated circuit testing apparatus comprising:
- a probe card;
- and
- a probe unit comprising a plurality of conductive elastomeric bumps and a plurality of conductors positioned to conduct signals from the bumps to said probe card;
- wherein said elastomeric bumps have been passivated to remove unbound bonds or dangling bonds.
1 more element
Dependencies are inferred from the claim text.