Testing current perpendicular to plane giant magnetoresistance multilayer devices
AssigneeThe United States of America as represented by the Secretary of the Navy
InventorsGary A. Prinz, Konrad Bussmann
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AssigneeThe United States of America as represented by the Secretary of the Navy
InventorsGary A. Prinz, Konrad Bussmann
Estimating the term…
A wafer suitable to be tested for current-perpendicular to the plane resistance includes a substrate, a conductive base layer on the substrate, a magnetic multilayer on the conductive base layer, and a top conductive layer. A testing ring is formed on the magnetic multilayer in a manner whereby it is separated from rest of the magnetic multilayer by a trench in the magnetic multilayer. Within the testing ring, the magnetic multilayer includes a hole. The current perpendicular to the plane resistance of the wafer may be determined by passing a predetermined current perpendicular through the testing ring by contacting a probe to the testing ring and measuring the voltage at the conductive base layer. The probe used in the present invention may be an AFM or a STM probe.
A method for determining a property of current perpendicular to the plane of a device including a substrate, a conductive base layer on the substrate and a magnetic multilayer containing a magnetic material on the conductive base layer comprising the steps of:
A device comprising:
A method for determining a property of current perpendicular to the plane of a device including a substrate, a conductive base layer on the substrate and a magnetic multilayer containing a magnetic material on the conductive base layer comprising the steps of:
Dependencies are inferred from the claim text.