Semiconductor device having a ball grid array and method therefor
AssigneeMotorola, Inc.
InventorsTerry E. Burnette, Thomas H. Koschmieder, Andrew J. Mawer
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Abstract
A semiconductor device (50) includes a semiconductor die (52) having electronic circuitry that is connected to a substrate (54). The substrate (54) is used to interface the semiconductor die (52) to a printed circuit board (64). The substrate (54) includes a plurality of bonding pads (56, 58). A first portion of the plurality of bonding pads are soldermask defined (SMD) bonding pads (56) and a second portion of the plurality of bonding pads are non-soldermask defined (NSMD) bonding pads (58). Using a combination of SMD and NSMD bonding pads provides the advantages of good thermal cycling reliability and good bending reliability over devices that have only SMD bonding pads or NSMD bonding pads.
Claims16
A semiconductor device, comprising:
- a semiconductor die having electronic circuitry;
- and
- a substrate for interfacing the semiconductor die to a printed circuit board, the substrate having a plurality of bonding pads for connecting to the printed circuit board, a first portion of the plurality of bonding pads being characterized as soldermask defined bonding pads and a second portion of the plurality of bonding pads being characterized as non-soldermask defined bonding pads.
A printed circuit board, comprising a plurality of bonding pads for connecting to a semiconductor device, a first portion of the plurality of bonding pads being characterized as soldermask defined bonding pads and a second portion of the plurality of bonding pads being characterized as non-soldermask defined bonding pads.
Dependencies are inferred from the claim text.