Ball grid array substrate with improved traces formed from copper based metal

A semiconductor device having a micro ball grid array package, comprising:

• an integrated circuit chip comprising a plurality of conductive pads and a plurality of transistor circuits, wherein at least some of the conductive pads are electrically coupled to at least some of the transistor circuits;
• a micro ball grid array package substrate having a first side and a second side;
• a plurality of conductive terminals formed on the first side of the micro ball grid array package substrate, at least one of the terminals of the micro ball grid array package substrate being electrically coupled to at least one of the conductive pads of the integrated circuit chip;
• an array of generally ball-shaped contacts formed on the second side of the micro ball grid array package substrate;
• and
• a plurality of traces formed on the first side of the package substrate, each trace providing at least part of an electrical coupling between at least one of the terminals and at least one of the contacts, and the traces being formed from a copper based metal having a tensile strength of more than about 60 kg per mm2.

A semiconductor device having a micro ball grid array package, comprising:

• an integrated circuit chip comprising a plurality of conductive pads and a plurality of transistor circuits, wherein at least some of the conductive pads are electrically coupled to at least some of the transistor circuits;
• a micro ball grid array package substrate having a first side and a second side;
• a plurality of conductive terminals formed on the first side of the micro ball grid array package substrate, at least one of the terminals of the micro ball grid array package substrate being electrically coupled to at least one of the conductive pads of the integrated circuit chip;
• an array of generally ball-shaped contacts formed on the second side of the micro ball grid array package substrate;
• a plurality of traces formed on the first side of the package substrate, each trace providing at least part of an electrical coupling between at least one of the terminals and at least one of the contacts, and the traces being formed from a copper based metal having a tensile strength of more than 60 kg per mm2 and a percent elongation of at least about 7% at room temperature.