Semiconductor device and liquid crystal module using the same
AssigneeSharp Kabushiki Kaisha
InventorKenji Toyosawa
Life of this patent
Estimating the term…
Abstract
A semiconductor device using TCP structure, includes a first semiconductor chip mounted on a tape carrier by ILB and a second semiconductor chip mounted on the tape carrier by stacking onto the first semiconductor chip. The first semiconductor chip is arranged so that a first electrode, formed on a surface of the first semiconductor chip, is connected to an inner lead via a first gold bump. The second semiconductor chip is arranged so that a third electrode formed on the second semiconductor chip is connected to a second electrode formed on the same surface as the first electrode via a second gold bump. In this fashion, it is possible to reduce a terminal pitch of the semiconductor device on which more than one semiconductor chip are mounted.
Claims13
A semiconductor device, comprising:
- a tape carrier including:
- a wiring pattern formed on an organic base having an opening portion;
- and the wiring pattern including an inner lead portion jutting into the opening portion;
- a semiconductor chip mounted in the opening portion of the tape carrier and a first electrode formed on a surface of the semiconductor chip, the first electrode connected to the inner lead via a first gold bump;
- and
- an electronic component, mounted on the tape carrier by stacking onto the semiconductor chip, the semiconductor chip including a second electrode formed on the same surface as the first electrode, the second electrode connected via a second gold bump to a third electrode formed on a first surface of the electronic component.
A semiconductor device, comprising:
- a tape carrier including;
- a wiring pattern formed on an organic base having an opening portion;
- and the wiring pattern including an inner lead portion jutting into the opening portion;
- a semiconductor chip mounted in the opening portion of the tape carrier, a first electrode formed on a surface of the semiconductor chip, the first electrode connected to the inner lead via a first gold bump;
- a first electronic component, mounted on the tape carrier by stacking onto the semiconductor chip, the semiconductor chip including a second electrode formed on the same surface as the first electrode, the second electrode connected to a third electrode formed on a first surface of the first electronic component;
- and
- a second electronic component having a first surface connected to the first electronic component by stacking onto a second surface of the first electronic component, and mounted on the tape carrier by wire-bonding.
A semiconductor device in which:
- a semiconductor chip is mounted on a tape carrier including a wiring pattern formed on an organic substrate having an opening in which the semiconductor chip is inserted, by connecting the semiconductor chip to an inner lead that is a part of the wiring pattern jutting into the opening;
- a first electrode formed by a first gold bump is connected to the inner lead and a second electrode formed by a second gold bump are formed on a surface of the semiconductor chip facing the inner lead;
- and
- an electronic component is mounted on the tape carrier by stacking onto the semiconductor chip thereby connecting the second electrode to a third electrode of the electronic component, the third electrode being made of a gold bump.
Dependencies are inferred from the claim text.